Inventor · disambiguated record
Takuya Ohno
Also filed as: OHNO TAKUYA
8 granted patents·8 pending applications·21 citations·filing 2003–2014
84Inventor score
Top patents by PatentIndex Score
16 records- 0181US7963308B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2006·Granted Jun 21, 2011·5 cites·23 claims
- 0279US8268113B2Apparatus and method for fabricating bonded substrateMURAMOTO TAKANORI·Filed 2011·Granted Sep 18, 2012·4 cites·4 claims
- 0376US7597774B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Oct 6, 2009·3 cites·4 claims
- 0471US7704348B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Apr 27, 2010·2 cites·1 claims
- 0570US8987177B2Biodegradable lubricant compositionOKADA TAHEI·Filed 2010·Granted Mar 24, 2015·1 cites·19 claims
- 0669US9139795B2Biodegradable lubricant compositionOKADA TAHEI·Filed 2010·Granted Sep 22, 2015·1 cites·7 claims
- 0769US9068136B2Lubricating oil composition for high-temperature applicationsOHNO TAKUYA·Filed 2011·Granted Jun 30, 2015·2 cites·18 claims
- 0856US7137427B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2003·Granted Nov 21, 2006·3 cites·9 claims
- 0953US2005236105A1Apparatus and method for manufacturing laminated substrateFUJITSU LTD·Filed 2004·Application pending·0 cites
- 1051US2011011541A1Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1151US2015353862A1High-temperature lubricant compositionIDEMITSU KOSAN CO·Filed 2014·Application pending·0 cites
- 1250US2010230030A1Apparatus and method for fabricating bonded substrateFUJITSU LTD KAWASAKI JAPAN·Filed 2010·Application pending·0 cites
- 1346US2007235130A1Apparatus and method for manufacturing laminated substrateFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1443US2006005920A1Method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1541US2014296117A1Biodegradable lubricating oil compositionOHNO TAKUYA·Filed 2012·Application pending·0 cites
- 1636US2003226633A1Method and apparatus for fabricating bonded substrateFUJITSU LTD·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takuya Ohno files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →