Inventor · disambiguated record
Jörg Schulze
Also filed as: SCHULZE JOERG · SCHULZE JOERG O · SCHULZE JORG · SCHULZE JÖRG
12 granted patents·7 pending applications·51 citations·filing 2001–2022
89Inventor score
Files withATOTECH DEUTSCHLAND GMBH4SCHULZE JÖRG4SCHULZE JOERG3GM GLOBAL TECH OPERATIONS INC2ATOTECH DEUTSCHLAND GMBH & CO KG1
Top patents by PatentIndex Score
19 records- 0185US9279542B2Compressed hydrogen fueling control valveGM GLOBAL TECH OPERATIONS INC·Filed 2014·Granted Mar 8, 2016·3 cites·20 claims
- 0284US8454058B2High pressure fitting for hydrogen applicationsPECHTOLD RAINER·Filed 2010·Granted Jun 4, 2013·8 cites·16 claims
- 0383US8505672B2Underbody integrated exhaust path for fuel cell vehiclesSCHULZE JOERG·Filed 2011·Granted Aug 13, 2013·8 cites·20 claims
- 0478US8973624B2Compressed hydrogen fueling control valveSCHULZE JÖRG·Filed 2011·Granted Mar 10, 2015·2 cites·5 claims
- 0577US8925567B2Thermal pressure relief device with expansion activationSCHULZE JÖRG·Filed 2011·Granted Jan 6, 2015·6 cites·20 claims
- 0670US9458004B2Fueling nozzle for gaseous fuels with integrated means for gas detectionSCHULZE JÖRG·Filed 2011·Granted Oct 4, 2016·4 cites·15 claims
- 0770US8936220B2Integrated shaped plastic exhaust system for fuel cell vehiclesSCHULZE JÖRG·Filed 2011·Granted Jan 20, 2015·4 cites·19 claims
- 0865US10448515B2Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen deviceATOTECH DEUTSCHLAND GMBH·Filed 2015·Granted Oct 15, 2019·2 cites·16 claims
- 0960US7101812B2Method of forming and/or modifying a dielectric film on a semiconductor surfaceMATTSON TECH INC·Filed 2003·Granted Sep 5, 2006·10 cites·33 claims
- 1050US6528433B2Method for monitoring nitrogen processesINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 4, 2003·4 cites·12 claims
- 1148US2024209512A1Method for plasma-treating a surface of a substrateATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2022·Application pending·0 cites
- 1247US2015166802A1Composition for forming a seed layerATOTECH DEUTSCHLAND GMBH·Filed 2013·Application pending·0 cites
- 1346US2016273112A1Electroless copper plating solutionATOTECH DEUTSCHLAND GMBH·Filed 2014·Application pending·0 cites
- 1439US9650718B2Electroless copper plating solutionATOTECH DEUTSCHLAND GMBH·Filed 2014·Granted May 16, 2017·0 cites·19 claims
- 1539US2011169259A1Tube fitting connectionGM GLOBAL TECH OPERATIONS INC·Filed 2010·Application pending·0 cites
- 1637US2012175366A1Vent hole alignment of temperature-pressure relief devices on pressure vesselsSCHULZE JOERG·Filed 2011·Application pending·0 cites
- 1735US2014017701A1Chimeric pdk1 kinasesBIONDI RICARDO M·Filed 2012·Application pending·0 cites
- 1832US2012046782A1Kinematic approximation algorithm having a ruled surfaceSCHULZE JOERG·Filed 2010·Application pending·0 cites
- 1928US9263609B2Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cellKÜHNLEIN HOLGER·Filed 2007·Granted Feb 16, 2016·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →