Inventor · disambiguated record
Jack Deng
Also filed as: DENG JACK
4 granted patents·1 pending application·39 citations·filing 2004–2008
74Inventor score
Top patents by PatentIndex Score
5 records- 0190US7264976B2Advance ridge structure for microlens gapless approachTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 4, 2007·19 cites·3 claims
- 0282US7505206B2Microlens structure for improved CMOS image sensor sensitivityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 17, 2009·14 cites·10 claims
- 0374US7507598B2Image sensor fabrication method and structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 24, 2009·6 cites·12 claims
- 0451US8129762B2Image sensorWENG FU-TIEN·Filed 2008·Granted Mar 6, 2012·0 cites·21 claims
- 0536US2006131710A1Advanced cavity structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →