Inventor · disambiguated record
Shin-Shing Jiang
Also filed as: JIANG SHIN-SHING
4 granted patents·25 citations·filing 2005–2005
73Inventor score
Files withVIA TECH INC4
Top patents by PatentIndex Score
4 records- 0184US7443272B2Signal transmission structure, circuit board and connector assembly structureVIA TECH INC·Filed 2005·Granted Oct 28, 2008·13 cites·14 claims
- 0271US7247937B2Mounting pad structure for wire-bonding type lead frame packagesVIA TECH INC·Filed 2005·Granted Jul 24, 2007·6 cites·20 claims
- 0365US7436268B2Signal transmission structure, circuit board and connector assembly structureVIA TECH INC·Filed 2005·Granted Oct 14, 2008·3 cites·20 claims
- 0463US7485966B2Via connection structure with a compensative area on the reference planeVIA TECH INC·Filed 2005·Granted Feb 3, 2009·3 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →