Inventor · disambiguated record
Amirul Afiq Hud
Also filed as: HUD AMIRUL AFIQ · HUD AMIRUL AFIQ BIN
7 granted patents·2 pending applications·11 citations·filing 2016–2025
76Inventor score
Files withINFINEON TECHNOLOGIES AUSTRIA AG4INFINEON TECHNOLOGIES AG2MICRON TECHNOLOGY INC2TEXAS INSTRUMENTS INC1
Top patents by PatentIndex Score
9 records- 0180US10373897B2Semiconductor devices with improved thermal and electrical performanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·4 cites·8 claims
- 0275US10147703B2Semiconductor package for multiphase circuitry deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 4, 2018·3 cites·23 claims
- 0372US10204845B2Semiconductor chip package having a repeating footprint patternINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 0464US9972576B2Semiconductor chip package comprising side wall markingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted May 15, 2018·1 cites·16 claims
- 0564US2025391825A1Semiconductor package with uneven stacked diesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0659US10083899B2Semiconductor package with heat slug and rivet free die attach areaINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 25, 2018·1 cites·14 claims
- 0759US2025149416A1Semiconductor assemblies with wire-bonded traces, and methods for making the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0848US11502045B2Electronic device with step cut leadTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 15, 2022·0 cites·41 claims
- 0944US10699978B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 30, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →