Inventor · disambiguated record
Osamu Miyata
Also filed as: MIYATA OSAMU
55 granted patents·4 pending applications·1,077 citations·filing 1980–2023
99Inventor score
Top patents by PatentIndex Score
59 records- 0197US7436063B2Packaging substrate and semiconductor deviceROHM CO LTD·Filed 2005·Granted Oct 14, 2008·70 cites·6 claims
- 0297US6133637ASemiconductor device having a plurality of semiconductor chipsROHM CO LTD·Filed 1998·Granted Oct 17, 2000·283 cites·24 claims
- 0396US8432046B2Semiconductor deviceMIYATA OSAMU·Filed 2011·Granted Apr 30, 2013·24 cites·32 claims
- 0496US7598613B2Flip chip bonding structureROHM CO LTD·Filed 2005·Granted Oct 6, 2009·44 cites·5 claims
- 0593US7714448B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2005·Granted May 11, 2010·13 cites·9 claims
- 0691US9601441B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2016·Granted Mar 21, 2017·4 cites·15 claims
- 0791US9312228B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2015·Granted Apr 12, 2016·4 cites·15 claims
- 0891US6607135B1Module for IC card, IC card, and method for manufacturing module for IC cardROHM CO LTD·Filed 1998·Granted Aug 19, 2003·117 cites·25 claims
- 0990US6160526AIC module and IC cardROHM CO LTD·Filed 1998·Granted Dec 12, 2000·112 cites·34 claims
- 1089US11842972B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2022·Granted Dec 12, 2023·1 cites·14 claims
- 1189US11069591B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·19 claims
- 1289US9111819B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2014·Granted Aug 18, 2015·4 cites·22 claims
- 1388US8928156B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2014·Granted Jan 6, 2015·4 cites·22 claims
- 1488US8786106B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2013·Granted Jul 22, 2014·4 cites·11 claims
- 1586US10431516B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2017·Granted Oct 1, 2019·2 cites·11 claims
- 1686US2024055384A1Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2023·Application pending·0 cites
- 1785US8575764B2Semiconductor device and method for manufacturing semiconductor deviceMIYATA OSAMU·Filed 2010·Granted Nov 5, 2013·4 cites·13 claims
- 1885US6458609B1Semiconductor device and method for manufacturing thereofROHM CO LTD·Filed 2000·Granted Oct 1, 2002·36 cites·7 claims
- 1983US6207473B1Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC cardROHM CO LTD·Filed 1998·Granted Mar 27, 2001·70 cites·12 claims
- 2082US7456049B2Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the sameROHM CO LTD·Filed 2006·Granted Nov 25, 2008·9 cites·11 claims
- 2181US6204564B1Semiconductor device and method for making the sameROHM CO LTD·Filed 1998·Granted Mar 20, 2001·63 cites·16 claims
- 2279US12057362B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·19 claims
- 2379US7456502B2Wiring board with connection electrode formed in opening and semiconductor device using the sameROHM CO LTD·Filed 2005·Granted Nov 25, 2008·7 cites·2 claims
- 2477US8659174B2Semiconductor deviceROHM CO LTD·Filed 2013·Granted Feb 25, 2014·3 cites·27 claims
- 2576US11355462B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·11 claims
- 2676US6308894B1IC module, method of manufacturing the same and IC card provided with IC moduleROHM CO LTD·Filed 1998·Granted Oct 30, 2001·49 cites·4 claims
- 2774US8405227B2Semiconductor device with a semiconductor chip connected in a flip chip mannerTANIDA KAZUMASA·Filed 2005·Granted Mar 26, 2013·3 cites·18 claims
- 2873US5055993AInvertor apparatusSTANLEY ELECTRIC CO LTD·Filed 1989·Granted Oct 8, 1991·27 cites·10 claims
- 2972US8063495B2Semiconductor deviceMIYATA OSAMU·Filed 2006·Granted Nov 22, 2011·4 cites·53 claims
- 3070US8653657B2Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor deviceMIYATA OSAMU·Filed 2006·Granted Feb 18, 2014·5 cites·23 claims
- 3169US10818628B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·13 claims
- 3269US7518230B2Semiconductor chip and semiconductor deviceROHM CO LTD·Filed 2006·Granted Apr 14, 2009·4 cites·3 claims
- 3369US7405485B2Semiconductor deviceROHM CO LTD·Filed 2005·Granted Jul 29, 2008·4 cites·9 claims
- 3467US8164201B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusKASAI MASAKI·Filed 2006·Granted Apr 24, 2012·3 cites·21 claims
- 3565US7688008B2Lighting lampSTANLEY ELECTRIC CO LTD·Filed 2006·Granted Mar 30, 2010·2 cites·16 claims
- 3665US6404142B2Starting device for discharge lampSTANLEY ELECTRIC CO LTD·Filed 2001·Granted Jun 11, 2002·11 cites·4 claims
- 3763US10522494B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·13 claims
- 3863US9831204B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2017·Granted Nov 28, 2017·0 cites·13 claims
- 3962US4834035AVariable swirl intake apparatus for engineMITSUBISHI MOTORS CORP·Filed 1985·Granted May 30, 1989·18 cites·3 claims
- 4061US9117774B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2014·Granted Aug 25, 2015·0 cites·30 claims
- 4159US9721865B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·28 claims
- 4259US8754535B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2013·Granted Jun 17, 2014·0 cites·32 claims
- 4358US7928581B2Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the sameROHM CO LTD·Filed 2005·Granted Apr 19, 2011·1 cites·70 claims
- 4457US6467941B1Vehicle lighting unitSTANLEY ELECTRIC CO LTD·Filed 2000·Granted Oct 22, 2002·4 cites·18 claims
- 4555US8723339B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusROHM CO LTD·Filed 2013·Granted May 13, 2014·0 cites·22 claims
- 4655US4909210AVariable swirl intake apparatus for engineMITSUBISHI MOTORS CORP·Filed 1989·Granted Mar 20, 1990·14 cites·7 claims
- 4751US8664779B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusKASAI MASAKI·Filed 2012·Granted Mar 4, 2014·0 cites·22 claims
- 4850US6479948B2Starting device for discharge lampHITACHI FERRITE ELECT LTD·Filed 2001·Granted Nov 12, 2002·4 cites·6 claims
- 4948US4746223AMeter for integrating the operating time of a steam trapTLV CO LTD·Filed 1985·Granted May 24, 1988·14 cites·1 claims
- 5047US5672550AMethod of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frameROHM CO LTD·Filed 1996·Granted Sep 30, 1997·13 cites·10 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Osamu Miyata files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →