Inventor · disambiguated record
Kwee Lan Tan
Also filed as: TAN KWEE LAN
4 granted patents·15 citations·filing 2004–2011
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0172US9034693B2Integrated circuit package with open substrate and method of manufacturing thereofSHIM IL KWON·Filed 2011·Granted May 19, 2015·2 cites·5 claims
- 0269US7008820B2Chip scale package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Mar 7, 2006·11 cites·11 claims
- 0366US8030783B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2009·Granted Oct 4, 2011·2 cites·14 claims
- 0449US7626277B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Dec 1, 2009·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →