Inventor · disambiguated record
Takahiko Takahashi
Also filed as: TAKAHASHI TAKAHIKO
13 granted patents·908 citations·filing 1983–1995
94Inventor score
Files withHITACHI LTD13
Top patents by PatentIndex Score
13 records- 0197US5055696AMultilayered device micro etching method and systemHITACHI LTD·Filed 1989·Granted Oct 8, 1991·207 cites·19 claims
- 0294US4868068AIC wiring connecting method and resulting articleHITACHI LTD·Filed 1987·Granted Sep 19, 1989·59 cites·43 claims
- 0393US4900695ASemiconductor integrated circuit device and process for producing the sameHITACHI LTD·Filed 1987·Granted Feb 13, 1990·151 cites·31 claims
- 0491US5683547AProcessing method and apparatus using focused energy beamHITACHI LTD·Filed 1994·Granted Nov 4, 1997·156 cites·5 claims
- 0587US6753253B1Method of making wiring and logic corrections on a semiconductor device by use of focused ion beamsHITACHI LTD·Filed 1990·Granted Jun 22, 2004·97 cites·19 claims
- 0686US5086015AMethod of etching a semiconductor device by an ion beamHITACHI LTD·Filed 1989·Granted Feb 4, 1992·75 cites·10 claims
- 0773US5182231AMethod for modifying wiring of semiconductor deviceHITACHI LTD·Filed 1990·Granted Jan 26, 1993·56 cites·19 claims
- 0870US5497034AIC wiring connecting method and apparatusHITACHI LTD·Filed 1994·Granted Mar 5, 1996·22 cites·72 claims
- 0968US5472507AIC wiring connecting method and apparatusHITACHI LTD·Filed 1994·Granted Dec 5, 1995·19 cites·44 claims
- 1068US5026664AMethod of providing a semiconductor IC device with an additional conduction pathHITACHI LTD·Filed 1989·Granted Jun 25, 1991·35 cites·26 claims
- 1154US5043297AWiring method of on-chip modification for an LSIHITACHI LTD·Filed 1990·Granted Aug 27, 1991·22 cites·12 claims
- 1251US5824598AIC wiring connecting method using focused energy beamsHITACHI LTD·Filed 1995·Granted Oct 20, 1998·9 cites·16 claims
- 1323US4469535AMethod of fabricating semiconductor integrated circuit devicesHITACHI LTD·Filed 1983·Granted Sep 4, 1984·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →