Inventor · disambiguated record
Juergen Schwandner
Also filed as: SCHWANDNER JUERGEN
21 granted patents·6 pending applications·39 citations·filing 2008–2014
91Inventor score
Top patents by PatentIndex Score
27 records- 0190US8376811B2Method for the double sided polishing of a semiconductor waferSILTRONIC AG·Filed 2010·Granted Feb 19, 2013·13 cites·19 claims
- 0281US9193026B2Method for polishing a semiconductor material waferSILTRONIC AG·Filed 2014·Granted Nov 24, 2015·4 cites·20 claims
- 0377US8647985B2Method for polishing a substrate composed of semiconductor materialSCHWANDNER JUERGEN·Filed 2008·Granted Feb 11, 2014·6 cites·13 claims
- 0475US8338302B2Method for polishing a semiconductor wafer with a strained-relaxed Si1−xGex layerSCHWANDNER JUERGEN·Filed 2009·Granted Dec 25, 2012·5 cites·21 claims
- 0572US8721390B2Method for the double-side polishing of a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted May 13, 2014·3 cites·11 claims
- 0668US8388411B2Method for polishing the edge of a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Mar 5, 2013·2 cites·18 claims
- 0767US8389409B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Mar 5, 2013·2 cites·14 claims
- 0863US8500516B2Method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Aug 6, 2013·1 cites·15 claims
- 0963US8444455B2Polishing pad and method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted May 21, 2013·1 cites·18 claims
- 1063US8376810B2Method for chemically grinding a semiconductor wafer on both sidesSILTRONIC AG·Filed 2010·Granted Feb 19, 2013·1 cites·20 claims
- 1160US8551870B2Method for producing an epitaxially coated semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Oct 8, 2013·1 cites·18 claims
- 1254US9308619B2Method for the double-side polishing of a semiconductor waferSILTRONIC AG·Filed 2014·Granted Apr 12, 2016·0 cites·6 claims
- 1349US8647173B2Method for polishing a semiconductor waferSILTRONIC AG·Filed 2013·Granted Feb 11, 2014·0 cites·10 claims
- 1449US2013072091A1Method for the double-side polishing of a semiconductor waferSCHWANDNER JUERGEN·Filed 2012·Application pending·0 cites
- 1548US9224613B2Method for polishing both sides of a semiconductor waferSCHWANDNER JUERGEN·Filed 2009·Granted Dec 29, 2015·0 cites·16 claims
- 1648US2013157543A1Polishing Pad and Method For Polishing A Semiconductor WaferSILTRONIC AG·Filed 2013·Application pending·0 cites
- 1746US2008265375A1Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx LayerSILTRONIC AG·Filed 2008·Application pending·0 cites
- 1845US2011097974A1Method for polishing a semiconductor waferSILTRONIC AG·Filed 2010·Application pending·0 cites
- 1942US8501028B2Method for grinding a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Aug 6, 2013·0 cites·16 claims
- 2041US10707069B2Method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Jul 7, 2020·0 cites·20 claims
- 2140US8882565B2Method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Nov 11, 2014·0 cites·10 claims
- 2239US9533394B2Method for the local polishing of a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Jan 3, 2017·0 cites·16 claims
- 2338US8529315B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Sep 10, 2013·0 cites·12 claims
- 2437US8343873B2Method for producing a semiconductor waferSILTRONIC AG·Filed 2010·Granted Jan 1, 2013·0 cites·23 claims
- 2536US8685270B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Apr 1, 2014·0 cites·10 claims
- 2636US2011081840A1Method for polishing semiconductor wafersSILTRONIC AG·Filed 2010·Application pending·0 cites
- 2732US2011133314A1Method for producing a semiconductor waferSILTRONIC AG·Filed 2010·Application pending·0 cites
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