Inventor · disambiguated record
Ananth Prabhakumar
Also filed as: PRABHAKUMAR ANANTH
5 granted patents·14 pending applications·101 citations·filing 2002–2022
81Inventor score
Top patents by PatentIndex Score
19 records- 0193US11355427B2Device, method and system for providing recessed interconnect structures of a substrateINTEL CORP·Filed 2016·Granted Jun 7, 2022·14 cites·19 claims
- 0288US8048819B2Cure catalyst, composition, electronic device and associated methodMOMENTIVE PERFORMANCE MAT INC·Filed 2005·Granted Nov 1, 2011·19 cites·8 claims
- 0387US7279223B2Underfill composition and packaged solid state deviceGEN ELECTRIC·Filed 2003·Granted Oct 9, 2007·26 cites·31 claims
- 0483US7022410B2Combinations of resin compositions and methods of use thereofGEN ELECTRIC·Filed 2003·Granted Apr 4, 2006·42 cites·17 claims
- 0562US2022148981A1Integrated circuit package with through void guard traceINTEL CORP·Filed 2022·Application pending·0 cites
- 0654US11264338B2Integrated circuit package with through void guard traceINTEL CORP·Filed 2018·Granted Mar 1, 2022·0 cites·25 claims
- 0752US2005148721A1Thin bond-line silicone adhesive composition and method for preparing the sameFiled 2005·Application pending·0 cites
- 0845US2006147719A1Curable composition, underfill, and methodRUBINSZTAJN SLAWOMIR·Filed 2006·Application pending·0 cites
- 0944US2005049350A1Thin bond-line silicone adhesive composition and method for preparing the sameFiled 2003·Application pending·0 cites
- 1039US2006192280A1Method of forming electronic devicesGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 1138US2005170188A1Resin compositions and methods of use thereofGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 1238US2005266263A1Refractory solid, adhesive composition, and device, and associated methodGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 1338US2006065387A1Electronic assemblies and methods of making the sameGEN ELECTRIC·Filed 2004·Application pending·0 cites
- 1437US2005049352A1Solvent-modified resin compositions and methods of use thereofFiled 2003·Application pending·0 cites
- 1536US2005048291A1Nano-filled composite materials with exceptionally high glass transition temperatureGEN ELECTRIC·Filed 2003·Application pending·0 cites
- 1636US2005048700A1No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performanceFiled 2003·Application pending·0 cites
- 1735US2005181214A1Curable epoxy compositions, methods and articles made therefromFiled 2004·Application pending·0 cites
- 1833US2005049334A1Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applicationsFiled 2003·Application pending·0 cites
- 1933US2004101688A1Curable epoxy compositions, methods and articles made therefromFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ananth Prabhakumar files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →