Inventor · disambiguated record
Sandeep Tonapi
Also filed as: TONAPI SANDEEP · TONAPI SANDEEP S · TONAPI SANDEEP SHRIKANT
8 granted patents·20 pending applications·232 citations·filing 2002–2008
89Inventor score
Top patents by PatentIndex Score
28 records- 0195US7297399B2Thermal transport structure and associated methodGEN ELECTRIC·Filed 2005·Granted Nov 20, 2007·52 cites·24 claims
- 0292US7797808B2Thermal management system and associated methodGEN ELECTRIC·Filed 2005·Granted Sep 21, 2010·16 cites·21 claims
- 0388US8048819B2Cure catalyst, composition, electronic device and associated methodMOMENTIVE PERFORMANCE MAT INC·Filed 2005·Granted Nov 1, 2011·19 cites·8 claims
- 0488US7550097B2Thermal conductive material utilizing electrically conductive nanoparticlesMOMENTIVE PERFORMANCE MAT INC·Filed 2003·Granted Jun 23, 2009·53 cites·26 claims
- 0587US7279223B2Underfill composition and packaged solid state deviceGEN ELECTRIC·Filed 2003·Granted Oct 9, 2007·26 cites·31 claims
- 0683US7022410B2Combinations of resin compositions and methods of use thereofGEN ELECTRIC·Filed 2003·Granted Apr 4, 2006·42 cites·17 claims
- 0756US6931092B2System and method for thermal management of CT detector circuitryGEN ELECTRIC·Filed 2003·Granted Aug 16, 2005·15 cites·40 claims
- 0853US7062008B2Detector assembly thermal management system and methodGEN ELECTRIC·Filed 2003·Granted Jun 13, 2006·9 cites·28 claims
- 0952US2005148721A1Thin bond-line silicone adhesive composition and method for preparing the sameFiled 2005·Application pending·0 cites
- 1049US2009256254A1Wafer level interconnection and methodGEN ELECTRIC·Filed 2008·Application pending·0 cites
- 1146US2007131912A1Electrically conductive adhesivesSIMONE DAVIDE L·Filed 2005·Application pending·0 cites
- 1244US2005049350A1Thin bond-line silicone adhesive composition and method for preparing the sameFiled 2003·Application pending·0 cites
- 1344US2008019097A1Thermal transport structureGEN ELECTRIC·Filed 2007·Application pending·0 cites
- 1441US2007284758A1Electronics package and associated methodGEN ELECTRIC·Filed 2006·Application pending·0 cites
- 1540US2006275608A1B-stageable film, electronic device, and associated processGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 1640US2006275952A1Method for making electronic devicesGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 1739US2004264148A1Method and system for fan fold packagingFiled 2003·Application pending·0 cites
- 1839US2006192280A1Method of forming electronic devicesGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 1938US2007241303A1Thermally conductive composition and method for preparing the sameGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 2038US2005170188A1Resin compositions and methods of use thereofGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 2138US2005266263A1Refractory solid, adhesive composition, and device, and associated methodGEN ELECTRIC·Filed 2005·Application pending·0 cites
- 2238US2006065387A1Electronic assemblies and methods of making the sameGEN ELECTRIC·Filed 2004·Application pending·0 cites
- 2337US2005049352A1Solvent-modified resin compositions and methods of use thereofFiled 2003·Application pending·0 cites
- 2436US2005048291A1Nano-filled composite materials with exceptionally high glass transition temperatureGEN ELECTRIC·Filed 2003·Application pending·0 cites
- 2536US2005048700A1No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performanceFiled 2003·Application pending·0 cites
- 2635US2005181214A1Curable epoxy compositions, methods and articles made therefromFiled 2004·Application pending·0 cites
- 2733US2005049334A1Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applicationsFiled 2003·Application pending·0 cites
- 2833US2004101688A1Curable epoxy compositions, methods and articles made therefromFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sandeep Tonapi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →