Inventor · disambiguated record
Kurt Hingerl
Also filed as: HINGERL KURT
9 granted patents·3 pending applications·20 citations·filing 2011–2021
82Inventor score
Top patents by PatentIndex Score
12 records- 0180US8975158B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Mar 10, 2015·7 cites·12 claims
- 0279US11694977B2Method for producing a connection between component partsOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2019·Granted Jul 4, 2023·5 cites·20 claims
- 0368US9252042B2Method for permanent bonding of wafersPLACH THOMAS·Filed 2011·Granted Feb 2, 2016·2 cites·30 claims
- 0468US9159717B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Oct 13, 2015·3 cites·19 claims
- 0565US10163681B2Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformationMARTINSCHITZ KLAUS·Filed 2011·Granted Dec 25, 2018·3 cites·26 claims
- 0657US11862466B2Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 0753US2019006313A1Method for permanent bonding of wafersEV GROUP E THALLNER GMBH·Filed 2018·Application pending·0 cites
- 0852US10083933B2Method for permanent bonding of wafersEV GROUP E THALLNER GMBH·Filed 2015·Granted Sep 25, 2018·0 cites·15 claims
- 0949US2017229423A1Method for permanently bonding wafersEV GROUP E THALLNER GMBH·Filed 2017·Application pending·0 cites
- 1045US10825793B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Nov 3, 2020·0 cites·8 claims
- 1142US10971365B2Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2017·Granted Apr 6, 2021·0 cites·15 claims
- 1238US2015165752A1Method and device for permanent bonding of wafersPLACH THOMAS·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →