Inventor · disambiguated record
Bo-Un Yoon
Also filed as: YOON BO UN
105 granted patents·32 pending applications·737 citations·filing 1998–2023
99Inventor score
Top patents by PatentIndex Score
137 records- 0198US9299700B2Semiconductor devices including a dummy gate structure on a finPARK SANG-JINE·Filed 2015·Granted Mar 29, 2016·33 cites·20 claims
- 0297US8344385B2Vertical-type semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 1, 2013·43 cites·20 claims
- 0396US8916460B1Semiconductor device and method for fabricating the sameKWON BYOUNG-HO·Filed 2014·Granted Dec 23, 2014·74 cites·8 claims
- 0494US9755079B2Semiconductor devices including insulating gates and methods for fabricating the samePARK SANG-JINE·Filed 2016·Granted Sep 5, 2017·13 cites·8 claims
- 0594US9548309B2Semiconductor devices including a dummy gate structure on a finPARK SANG-JINE·Filed 2016·Granted Jan 17, 2017·10 cites·7 claims
- 0694US7531456B2Method of forming self-aligned double patternSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 12, 2009·29 cites·23 claims
- 0793US9704864B2Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a finPARK SANG-JINE·Filed 2015·Granted Jul 11, 2017·14 cites·19 claims
- 0892US9659940B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 23, 2017·10 cites·20 claims
- 0992US9627542B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 18, 2017·6 cites·20 claims
- 1092US6626968B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 30, 2003·53 cites·27 claims
- 1191US9728535B2Methods of fabricating semiconductor devices including fin-shaped active regionsYOUN YOUNG-SANG·Filed 2016·Granted Aug 8, 2017·11 cites·18 claims
- 1289US9305825B2Methods of fabricating semiconductor devices including fin-shaped active regionsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 5, 2016·7 cites·20 claims
- 1388US10192973B2Methods of forming semiconductor devices including trench walls having multiple slopesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 29, 2019·5 cites·17 claims
- 1488US9947672B2Semiconductor devices including a dummy gate structure on a finSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 17, 2018·4 cites·8 claims
- 1588US8766343B2Integrated circuit capacitors having sidewall supportsKANG DAE-HYUK·Filed 2012·Granted Jul 1, 2014·10 cites·20 claims
- 1688US8119476B2Methods of forming integrated circuit capacitors having sidewall supports and capacitors formed therebyKANG DAE-HYUK·Filed 2010·Granted Feb 21, 2012·10 cites·16 claims
- 1787US11011526B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
- 1887US10943908B2Method of forming semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·7 cites·16 claims
- 1987US8398874B2Methods of manufacturing semiconductors using dummy patternsKWON BYOUNG-HO·Filed 2010·Granted Mar 19, 2013·8 cites·16 claims
- 2086US10109529B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 23, 2018·6 cites·11 claims
- 2186US10096605B2Semiconductor devices including a dummy gate structure on a finSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 9, 2018·3 cites·16 claims
- 2286US9443979B2Semiconductor devices including trench walls having multiple slopesPARK SANG-JINE·Filed 2014·Granted Sep 13, 2016·7 cites·20 claims
- 2386US9190407B2Semiconductor device and method for fabricating the sameKWON BYOUNG-HO·Filed 2014·Granted Nov 17, 2015·5 cites·19 claims
- 2486US8673724B2Methods of fabricating semiconductor devicesPARK SANG-JINE·Filed 2012·Granted Mar 18, 2014·9 cites·20 claims
- 2586US6517412B2Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·40 cites·25 claims
- 2685US10032890B2Method of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·7 cites·20 claims
- 2784US10128236B2Semiconductor device and method for fabricating the sameJEONG JI MIN·Filed 2016·Granted Nov 13, 2018·6 cites·16 claims
- 2884US6610596B1Method of forming metal interconnection using plating and semiconductor device manufactured by the methodSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 26, 2003·33 cites·14 claims
- 2982US10090190B2Methods of fabricating semiconductor devices including fin-shaped active regionsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 2, 2018·2 cites·18 claims
- 3082US8803248B2Semiconductor devices and methods of manufacturing the samePARK SANG-JINE·Filed 2011·Granted Aug 12, 2014·5 cites·6 claims
- 3182US8053845B2Semiconductor device including dummy gate part and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 8, 2011·7 cites·9 claims
- 3282US6887137B2Chemical mechanical polishing slurry and chemical mechanical polishing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 3, 2005·28 cites·53 claims
- 3381US10128246B2Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a finSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 13, 2018·3 cites·17 claims
- 3481US8038508B2Apparatus for polishing a wafer and method for detecting a polishing end point by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 18, 2011·7 cites·17 claims
- 3581US7678625B2Methods of fabricating semiconductor devices including channel layers having improved defect density and surface roughness characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 3680US9590073B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 7, 2017·4 cites·17 claims
- 3780US6914001B2Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 5, 2005·20 cites·17 claims
- 3879US10734380B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·2 cites·3 claims
- 3979US10403640B2Semiconductor devices including insulating capping structuresSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·3 cites·20 claims
- 4079US9466697B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 11, 2016·2 cites·8 claims
- 4179US9136135B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·4 cites·12 claims
- 4278US7196010B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 27, 2007·16 cites·34 claims
- 4376US8962415B2Methods of forming gates of semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 24, 2015·3 cites·15 claims
- 4476US7670942B2Method of fabricating self-aligned contact pad using chemical mechanical polishing processSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 2, 2010·6 cites·20 claims
- 4575US10056466B2Methods for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 21, 2018·3 cites·20 claims
- 4675US7535052B2Method of fabricating non-volatile memory integrated circuit device and non-volatile memory integrated circuit device fabricated using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·4 cites·10 claims
- 4774US9035396B2Semiconductor device including dummy gate part and method of fabricating the sameKWON BYOUNG-HO·Filed 2011·Granted May 19, 2015·3 cites·32 claims
- 4874US7675175B2Semiconductor device having isolated pockets of insulation in conductive seal ringOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Mar 9, 2010·9 cites·3 claims
- 4972US8475238B2Polishing pads including sidewalls and related polishing apparatusesCHOI JAE-KWANG·Filed 2010·Granted Jul 2, 2013·3 cites·18 claims
- 5071US8652915B2Methods of fabricating semiconductor devices using preliminary trenches with epitaxial growthAHN KEVIN·Filed 2011·Granted Feb 18, 2014·4 cites·16 claims
Showing the top 50 of 137 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Bo-Un Yoon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →