Inventor · disambiguated record
Bernhard Stering
Also filed as: STERING BERNHARD
7 granted patents·1 pending application·6 citations·filing 2012–2020
73Inventor score
Top patents by PatentIndex Score
8 records- 0175US9842946B2Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production methodAMS AG·Filed 2015·Granted Dec 12, 2017·3 cites·11 claims
- 0263US10256147B2Dicing methodAMS AG·Filed 2015·Granted Apr 9, 2019·1 cites·5 claims
- 0355US9961777B2Method for cutting a carrier for electrical componentsSTERING BERNHARD·Filed 2012·Granted May 1, 2018·2 cites·14 claims
- 0445US2022317391A1Bonded structure and method for manufacturing a bonded structureAMS AG·Filed 2020·Application pending·0 cites
- 0539US10978507B2Method for manufacturing optical sensor arrangements and housing for an optical sensorAMS AG·Filed 2017·Granted Apr 13, 2021·0 cites·8 claims
- 0639US9105645B2Method for producing thin semiconductor componentsAMS AG·Filed 2012·Granted Aug 11, 2015·0 cites·7 claims
- 0738US10217715B2Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor deviceAMS AG·Filed 2015·Granted Feb 26, 2019·0 cites·10 claims
- 0835US9917012B2Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packagingAMS AG·Filed 2015·Granted Mar 13, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →