Inventor · disambiguated record
Hee-Jung Hwang
Also filed as: HWANG HEE-JUNG
8 granted patents·2 pending applications·96 citations·filing 2007–2017
81Inventor score
Top patents by PatentIndex Score
10 records- 0195US8183046B2Temperature resistant pH buffers for use at low temperaturesLU YI·Filed 2007·Granted May 22, 2012·88 cites·15 claims
- 0269US9263492B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 16, 2016·3 cites·18 claims
- 0365US9177887B2Semiconductor test device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·2 cites·18 claims
- 0464US9704815B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 11, 2017·1 cites·18 claims
- 0558US8994169B2Semiconductor packages usable with a mobile deviceKIM JI-CHUL·Filed 2012·Granted Mar 31, 2015·2 cites·21 claims
- 0647US9666503B2Semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 30, 2017·0 cites·20 claims
- 0742US2014264339A1Heat slug having thermoelectric elements and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0841US10256174B2Film type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
- 0937US8648478B2Flexible heat sink having ventilation ports and semiconductor package including the sameYOO JAE-WOOK·Filed 2011·Granted Feb 11, 2014·0 cites·17 claims
- 1037US2011304763A1Image sensor chip and camera module having the sameCHOI MI-NA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →