Inventor · disambiguated record
Richard L. Groover
Also filed as: GROOVER RICHARD L
6 granted patents·311 citations·filing 1994–2005
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0194US7045883B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2005·Granted May 16, 2006·44 cites·22 claims
- 0293US6597059B1Thermally enhanced chip scale lead on chip semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 22, 2003·91 cites·17 claims
- 0387US6873032B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 29, 2005·44 cites·17 claims
- 0483US5598031AElectrically and thermally enhanced package using a separate silicon substrateVLSI TECHNOLOGY INC·Filed 1994·Granted Jan 28, 1997·81 cites·40 claims
- 0574US7064009B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 20, 2006·22 cites·17 claims
- 0657US5530281AWirebond lead system with improved wire separationVLSI TECHNOLOGY INC·Filed 1994·Granted Jun 25, 1996·29 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →