Inventor · disambiguated record
Bryan Carson
Also filed as: CARSON BRYAN · CARSON BRYAN C
13 granted patents·42 citations·filing 1998–2020
89Inventor score
Top patents by PatentIndex Score
13 records- 0186US11171604B1Active shunt capacitance cancelling oscillator for resonatorsNAT TECH & ENG SOLUTIONS SANDIA LLC·Filed 2020·Granted Nov 9, 2021·2 cites·19 claims
- 0285US11366116B1Real time autonomous surveillance of pathogensNAT TECH & ENG SOLUTIONS SANDIA LLC·Filed 2018·Granted Jun 21, 2022·8 cites·19 claims
- 0376US12084708B1Acoustic wave resonator with active shunt capacitance cancellation and systems thereofNAT TECH & ENG SOLUTIONS SANDIA LLC·Filed 2020·Granted Sep 10, 2024·1 cites·24 claims
- 0459US10126299B2Amplification of biological targets via on-chip culture for biosensingNAT TECH & ENG SOLUTIONS SANDIA LLC·Filed 2017·Granted Nov 13, 2018·0 cites·16 claims
- 0558US9857370B2Amplification of biological targets via on-chip culture for biosensingNAT TECH & ENG SOLUTIONS SANDIA LLC·Filed 2014·Granted Jan 2, 2018·1 cites·26 claims
- 0655US6172929B1Integrated circuit having aligned fuses and methods for forming and programming the fusesMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 9, 2001·14 cites·47 claims
- 0753US6784043B2Methods for forming aligned fuses disposed in an integrated circuitMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 31, 2004·7 cites·23 claims
- 0848US6522595B2Methods for forming and programming aligned fuses disposed in an integrated circuitMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 18, 2003·5 cites·26 claims
- 0940US6921318B2Semiconductor die de-processing using a die holder and chemical mechanical polishingMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 26, 2005·0 cites·16 claims
- 1036US6642084B2Methods for forming aligned fuses disposed in an integrated circuitMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 4, 2003·1 cites·17 claims
- 1133US6248001B1Semiconductor die de-processing using a die holder and chemical mechanical polishingMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 19, 2001·3 cites·26 claims
- 1230US6235622B1Method and apparatus for isolating a conductive region from a substrate during manufacture of an integrated circuit and connected to the substrate after manufactureMICRON TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·0 cites·16 claims
- 1330US6137119AApparatus for isolating a conductive region from a substrate during manufacture of an integrated circuit and connecting the conductive region to the substrate after manufactureMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 24, 2000·0 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →