Inventor · disambiguated record
Douglas W. Phelps, Jr.
Also filed as: PHELPS DOUGLAS W · PHELPS JR DOUGLAS W · PHELPS JR DOUGLAS WALLACE
14 granted patents·1,338 citations·filing 1981–1998
95Inventor score
Files withIBM10
Top patents by PatentIndex Score
14 records- 0196US4862245APackage semiconductor chipIBM·Filed 1988·Granted Aug 29, 1989·670 cites·20 claims
- 0294US4796078APeripheral/area wire bonding techniqueIBM·Filed 1987·Granted Jan 3, 1989·166 cites·18 claims
- 0393US4447857ASubstrate with multiple type connectionsIBM·Filed 1981·Granted May 8, 1984·101 cites·4 claims
- 0487US4821945ASingle lead automatic clamping and bonding systemIBM·Filed 1987·Granted Apr 18, 1989·92 cites·15 claims
- 0586US4965654ASemiconductor package with ground planeIBM·Filed 1989·Granted Oct 23, 1990·80 cites·9 claims
- 0682US4878108AHeat dissipation package for integrated circuitsIBM·Filed 1987·Granted Oct 31, 1989·58 cites·26 claims
- 0771US4907734AMethod of bonding gold or gold alloy wire to lead tin solderIBM·Filed 1988·Granted Mar 13, 1990·42 cites·12 claims
- 0869US5696032ATape application platform and processes thereforFiled 1996·Granted Dec 9, 1997·28 cites·8 claims
- 0967US6043557ATape application platform and processes thereforFiled 1998·Granted Mar 28, 2000·25 cites·10 claims
- 1062US4551912AHighly integrated universal tape bondingIBM·Filed 1985·Granted Nov 12, 1985·30 cites·12 claims
- 1159US5661336ATape application platform and processes thereforFiled 1994·Granted Aug 26, 1997·20 cites·13 claims
- 1251US4417120APercussive arc weldingIBM·Filed 1981·Granted Nov 22, 1983·10 cites·14 claims
- 1345US5889320ATape application platform and processes thereforFiled 1997·Granted Mar 30, 1999·9 cites·39 claims
- 1434US4714953AWelded wire coolingIBM·Filed 1986·Granted Dec 22, 1987·7 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →