Inventor · disambiguated record
Teruji Inomata
Also filed as: INOMATA TERUJI
4 granted patents·6 pending applications·20 citations·filing 2002–2009
72Inventor score
Top patents by PatentIndex Score
10 records- 0178US7370786B2Bonding method and bonding apparatusNEC ELECTRONICS CORP·Filed 2005·Granted May 13, 2008·5 cites·9 claims
- 0275US7554191B2Semiconductor device having a heatsink plate with bored portionsNEC ELECTRONICS CORP·Filed 2007·Granted Jun 30, 2009·7 cites·1 claims
- 0359US6932262B2Bonding method and bonding apparatusNEC ELECTRONICS CORP·Filed 2003·Granted Aug 23, 2005·7 cites·6 claims
- 0448US2009023252A1Method of manufacturing semiconductor device having a heat sink with a bored portionNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 0545US2010140796A1Manufacturing method of semiconductor device, and semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 0643US2007228115A1Method of manufacturing an electronic componentNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 0742US6814274B2Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding methodNEC ELECTRONICS CORP·Filed 2002·Granted Nov 9, 2004·1 cites·11 claims
- 0842US2009250826A1Process for manufacturing semiconductor device and semiconductor device manufactured by such processNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 0939US2008251913A1Semiconductor device including wiring substrate having element mounting surface coated by resin layerNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1034US2002106903A1Manufacturing method of semiconductor deviceNEC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →