Inventor · disambiguated record
Takehiro Endo
Also filed as: ENDO TAKEHIRO
10 granted patents·1 pending application·8 citations·filing 2012–2020
79Inventor score
Top patents by PatentIndex Score
11 records- 0174US8917000B2Arrangement structure of connecting conductor connecting inside and outside conductors of motorHONDA MOTOR CO LTD·Filed 2012·Granted Dec 23, 2014·3 cites·26 claims
- 0264US9564706B2Connection unitHONDA MOTOR CO LTD·Filed 2014·Granted Feb 7, 2017·5 cites·7 claims
- 0361US11152247B2Semiconductor device and manufacturing method thereofSEIKO EPSON CORP·Filed 2020·Granted Oct 19, 2021·0 cites·3 claims
- 0450US10714375B2Semiconductor device and manufacturing method thereofSEIKO EPSON CORP·Filed 2016·Granted Jul 14, 2020·0 cites·12 claims
- 0541US9728566B2Solid state imaging device and manufacturing method thereofSEIKO EPSON CORP·Filed 2016·Granted Aug 8, 2017·0 cites·8 claims
- 0639US9818789B2Solid-state imaging device and manufacturing method thereofSEIKO EPSON CORP·Filed 2016·Granted Nov 14, 2017·0 cites·13 claims
- 0737US9818790B2Solid-state imaging device and manufacturing method thereofSEIKO EPSON CORP·Filed 2016·Granted Nov 14, 2017·0 cites·8 claims
- 0837US9786616B2Semiconductor apparatus, method for manufacturing the same, electronic device, and moving bodySEIKO EPSON CORP·Filed 2016·Granted Oct 10, 2017·0 cites·13 claims
- 0936US10541299B2Semiconductor device and manufacturing method thereofSEIKO EPSON CORP·Filed 2016·Granted Jan 21, 2020·0 cites·8 claims
- 1036US2017077156A1Solid state imaging element and manufacturing method thereof, and electronic apparatusSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 1135US9520436B2Solid-state imaging device and manufacturing method thereofSEIKO EPSON CORP·Filed 2016·Granted Dec 13, 2016·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →