Inventor · disambiguated record
Jung Bum Woo
Also filed as: WOO JUNG BUM
2 granted patents·2 pending applications·6 citations·filing 2007–2024
44Inventor score
Top patents by PatentIndex Score
4 records- 0165US7546941B2Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jun 16, 2009·6 cites·22 claims
- 0254US2025022743A1Collet structure and semiconductor fabricating apparatus including the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0342US12106996B2Collet structure and semiconductor fabricating apparatus including the sameSK HYNIX INC·Filed 2021·Granted Oct 1, 2024·0 cites·12 claims
- 0438US2022120712A1Defect inspection apparatus using an eddy current and semiconductor die bonding equipment using the sameSK HYNIX INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →