Inventor · disambiguated record
Tien-Hsi Lee
Also filed as: LEE TIEN-HSI
7 granted patents·3 pending applications·592 citations·filing 2000–2024
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3UNIV NAT CENTRAL3LEE TIEN-HSI2JOHN WOLF INTERNATIONAL INC1KINIK CO1
Top patents by PatentIndex Score
10 records- 0198US9256123B2Method of making an extreme ultraviolet pellicleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 9, 2016·365 cites·20 claims
- 0293US6486008B1Manufacturing method of a thin film on a substrateJOHN WOLF INTERNATIONAL INC·Filed 2000·Granted Nov 26, 2002·212 cites·32 claims
- 0388US9664999B2Method of making an extreme ultraviolet pellicleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·2 cites·20 claims
- 0466US8088672B2Producing a transferred layer by implanting ions through a sacrificial layer and an etching stop layerLEE TIEN-HSI·Filed 2008·Granted Jan 3, 2012·6 cites·20 claims
- 0559US9442368B2Method of making an extreme ultraviolet pellicleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 13, 2016·0 cites·20 claims
- 0655US2024158309A1Material surface treatment equipment, material surface treatment method and silicon carbide material surface treatment methodUNIV NAT CENTRAL·Filed 2022·Application pending·0 cites
- 0754US12501676B2Silicon carbide substrate or substrate processing methodUNIV NAT CENTRAL·Filed 2022·Granted Dec 16, 2025·0 cites·18 claims
- 0853US7459025B2Methods for transferring a layer onto a substrateLEE TIEN-HSI·Filed 2003·Granted Dec 2, 2008·7 cites·22 claims
- 0951US2025132162A1Semiconductor substrate processing methodUNIV NAT CENTRAL·Filed 2024·Application pending·0 cites
- 1041US2010044827A1Method for making a substrate structure comprising a film and substrate structure made by same methodKINIK CO·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →