Inventor · disambiguated record
Jen-Rong Huang
Also filed as: HUANG JEN-RONG
11 granted patents·6 pending applications·164 citations·filing 1999–2012
89Inventor score
Top patents by PatentIndex Score
17 records- 0192US6622883B1Door for wafer container having rotatable cammed member and movable linksIND TECH RES INST·Filed 2000·Granted Sep 23, 2003·81 cites·20 claims
- 0279US8896135B2Encapsulation film, package structure utilizing the same, and method for forming the package structureWANG CHING-CHIUN·Filed 2011·Granted Nov 25, 2014·4 cites·5 claims
- 0379US6398033B1Wafer container with retractable handleIND TECH RES INST·Filed 2000·Granted Jun 4, 2002·27 cites·12 claims
- 0476US7449091B2Wafer electroplating apparatusIND TECH RES INST·Filed 2005·Granted Nov 11, 2008·2 cites·20 claims
- 0569US8944347B2Deposition nozzle and apparatus for thin film deposition processHUANG JEN-RONG·Filed 2012·Granted Feb 3, 2015·1 cites·19 claims
- 0667US7021208B2Compress and position apparatusIND TECH RES INST·Filed 2004·Granted Apr 4, 2006·7 cites·14 claims
- 0763US6220771B1Wafer backside protection apparatusIND TECH RES INST·Filed 1999·Granted Apr 24, 2001·30 cites·17 claims
- 0862US7238265B2Electroplating apparatus with functions of voltage detection and flow rectificationIND TECH RES INST·Filed 2003·Granted Jul 3, 2007·4 cites·12 claims
- 0954US2009090616A1System and method for plasma enhanced thin film depositionIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1052US6390394B1Nozzle and adjust moduleIND TECH RES INST·Filed 2000·Granted May 21, 2002·4 cites·4 claims
- 1150US6653245B2Method for liquid phase depositionIND TECH RES INST·Filed 2001·Granted Nov 25, 2003·4 cites·3 claims
- 1248US2010141147A1Capacitively coupled plasma (ccp) generator with two input portsIND TECH RES INST·Filed 2009·Application pending·0 cites
- 1348US2010164381A1Long linear-type microwave plasma source using variably-reduced-height rectangular waveguide as plasma reactorIND TECH RES INST·Filed 2009·Application pending·0 cites
- 1437US2012070590A1Plasma enhanced atomic layer deposition apparatus and the controlling method thereofHUANG JEN-RONG·Filed 2010·Application pending·0 cites
- 1536US2003219978A1Method and apparatus for liquid phase depositionIND TECH RES INST·Filed 2002·Application pending·0 cites
- 1635US2004124090A1Wafer electroplating apparatus and methodFiled 2002·Application pending·0 cites
- 1734US8435803B2Method for depositing microcrystalline silicon and monitor device of plasma enhanced depositionDU CHEN-CHUNG·Filed 2010·Granted May 7, 2013·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →