Inventor · disambiguated record
Harry R. Bickford
Also filed as: BICKFORD HARRY R · BICKFORD HARRY RANDALL
19 granted patents·934 citations·filing 1988–1997
96Inventor score
Top patents by PatentIndex Score
19 records- 0197US5134460AAluminum bump, reworkable bump, and titanium nitride structure for tab bondingIBM·Filed 1990·Granted Jul 28, 1992·265 cites·15 claims
- 0295US5374454AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1993·Granted Dec 20, 1994·71 cites·39 claims
- 0390US4862322ADouble electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetweenBICKFORD HARRY R·Filed 1988·Granted Aug 29, 1989·116 cites·12 claims
- 0485US5028983AMultilevel integrated circuit packaging structuresIBM·Filed 1988·Granted Jul 2, 1991·78 cites·24 claims
- 0582US5730890AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1996·Granted Mar 24, 1998·35 cites·29 claims
- 0679US5318803AConditioning of a substrate for electroless plating thereonIBM·Filed 1990·Granted Jun 7, 1994·48 cites·28 claims
- 0777US4939570AHigh power, pluggable tape automated bonding packageIBM·Filed 1988·Granted Jul 3, 1990·49 cites·9 claims
- 0873US4956605ATab mounted chip burn-in apparatusIBM·Filed 1989·Granted Sep 11, 1990·32 cites·9 claims
- 0972US5800858AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1996·Granted Sep 1, 1998·20 cites·7 claims
- 1071US5480841AProcess of multilayer conductor chip packagingIBM·Filed 1994·Granted Jan 2, 1996·36 cites·13 claims
- 1171US4937006AMethod and apparatus for fluxless solder bondingIBM·Filed 1988·Granted Jun 26, 1990·43 cites·22 claims
- 1269US4832255APrecision solder transfer method and meansIBM·Filed 1988·Granted May 23, 1989·34 cites·9 claims
- 1363US6060905AVariable voltage, variable impedance CMOS off-chip driver and receiver interface and circuitsIBM·Filed 1996·Granted May 9, 2000·18 cites·14 claims
- 1460US5399902ASemiconductor chip packaging structure including a ground planeIBM·Filed 1993·Granted Mar 21, 1995·25 cites·18 claims
- 1558US5709906AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1995·Granted Jan 20, 1998·12 cites·33 claims
- 1656US8604828B1Variable voltage CMOS off-chip driver and receiver circuitsBICKFORD HARRY RANDALL·Filed 1996·Granted Dec 10, 2013·16 cites·3 claims
- 1751US5949272ABidirectional off-chip driver with receiver bypassIBM·Filed 1997·Granted Sep 7, 1999·11 cites·8 claims
- 1850US5874154AStructure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive patternIBM·Filed 1996·Granted Feb 23, 1999·9 cites·7 claims
- 1945US5205461AMethod and apparatus for fluxless solder bondingIBM·Filed 1990·Granted Apr 27, 1993·16 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →