Inventor · disambiguated record
Ying Trickett
Also filed as: TRICKETT YING
3 granted patents·2 pending applications·7 citations·filing 2016–2023
57Inventor score
Files withTOKYO ELECTRON LTD5
Top patents by PatentIndex Score
5 records- 0192US10861744B2Platform and method of operating for integrated end-to-end CMP-less interconnect processTOKYO ELECTRON LTD·Filed 2019·Granted Dec 8, 2020·7 cites·18 claims
- 0255US12237216B2Method for filling recessed features in semiconductor devices with a low-resistivity metalTOKYO ELECTRON LTD·Filed 2022·Granted Feb 25, 2025·0 cites·21 claims
- 0353US2024405022A1Non-planar transistor structures and methods of manufacturing thereofTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0452US2025105059A1Method of via fillingTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0543US10008564B2Method of corner rounding and trimming of nanowires by microwave plasmaTOKYO ELECTRON LTD·Filed 2016·Granted Jun 26, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →