Inventor · disambiguated record
Patrick M. Paluda
Also filed as: PALUDA PATRICK M
4 granted patents·1 pending application·29 citations·filing 2001–2008
76Inventor score
Files withINTEL CORP4
Top patents by PatentIndex Score
5 records- 0172US7855103B2Wirebond structure and method to connect to a microelectronic dieINTEL CORP·Filed 2008·Granted Dec 21, 2010·4 cites·4 claims
- 0267US6683383B2Wirebond structure and method to connect to a microelectronic dieINTEL CORP·Filed 2001·Granted Jan 27, 2004·11 cites·6 claims
- 0366US7393772B2Wirebond structure and method to connect to a microelectronic dieINTEL CORP·Filed 2004·Granted Jul 1, 2008·10 cites·7 claims
- 0453US6924554B2Wirebond structure and method to connect to a microelectronic dieINTEL CORP·Filed 2003·Granted Aug 2, 2005·4 cites·10 claims
- 0536US2004072448A1Protecting delicate semiconductor features during wet etchingFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →