Inventor · disambiguated record
Hang Lim Lee
Also filed as: LEE HANG LIM
3 granted patents·1 pending application·6 citations·filing 2014–2023
54Inventor score
Files withSEMES CO LTD4
Top patents by PatentIndex Score
4 records- 0173US9620476B2Bonding head and die bonding apparatus having the sameSEMES CO LTD·Filed 2014·Granted Apr 11, 2017·6 cites·15 claims
- 0258US2024203746A1Chemical etching method using a metal catalystSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0357US12327810B2Die surface treatment apparatus and die bonding system including the sameSEMES CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·18 claims
- 0450US12506113B2Method of bonding a semiconductor die to a waferSEMES CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →