Inventor · disambiguated record
Harry Chandra
Also filed as: CHANDRA HARRY
5 granted patents·7 pending applications·83 citations·filing 2008–2023
80Inventor score
Top patents by PatentIndex Score
12 records- 0193US8598690B2Semiconductor device having conductive vias in peripheral region connecting shielding layer to groundCHANDRA HARRY·Filed 2012·Granted Dec 3, 2013·20 cites·19 claims
- 0293US8110441B2Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor dieCHANDRA HARRY·Filed 2008·Granted Feb 7, 2012·37 cites·12 claims
- 0384US8723302B2Integrated circuit package system with input/output expansionCHANDRA HARRY·Filed 2008·Granted May 13, 2014·14 cites·20 claims
- 0482US8653654B2Integrated circuit packaging system with a stackable package and method of manufacture thereofCHANDRA HARRY·Filed 2009·Granted Feb 18, 2014·12 cites·20 claims
- 0562US2025182950A1Integrated transformer and ic packagesALLEGRO MICROSYSTEMS LLC·Filed 2023·Application pending·0 cites
- 0662US2025182948A1Leadless transformer packagesALLEGRO MICROSYSTEMS LLC·Filed 2023·Application pending·0 cites
- 0758US2025140673A1Package configuration for high voltage gate drivers with a transformerALLEGRO MICROSYSTEMS LLC·Filed 2023·Application pending·0 cites
- 0857US2025174611A1Leadframe-based integrated transformer packagesALLEGRO MICROSYSTEMS LLC·Filed 2023·Application pending·0 cites
- 0956US2025201771A1Laminated substrate packages configured for coupling to isolation transformersALLEGRO MICROSYSTEMS LLC·Filed 2023·Application pending·0 cites
- 1051US10991644B2Integrated circuit package having a low profileALLEGRO MICROSYSTEMS LLC·Filed 2019·Granted Apr 27, 2021·0 cites·38 claims
- 1142US2010059783A1Light Emitting Chip Package With Metal Leads For Enhanced Heat DissipationCHANDRA HARRY·Filed 2008·Application pending·0 cites
- 1241US2022406830A1Photoreceiver array having microlensesALLEGRO MICROSYSTEMS LLC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →