Inventor · disambiguated record
Clay E. Hudgins
Also filed as: HUDGINS CLAY E
9 granted patents·4 pending applications·106 citations·filing 1999–2011
88Inventor score
Top patents by PatentIndex Score
13 records- 0191US7856185B2Wireless monitoring of optoelectronic modules and network componentsEMCORE CORP·Filed 2007·Granted Dec 21, 2010·31 cites·16 claims
- 0290US7794157B2Wireless tuning and reconfiguration of network units including optoelectronic componentsEMCORE CORP·Filed 2009·Granted Sep 14, 2010·20 cites·20 claims
- 0382US7918611B2Reconfiguration and protocol adaptation of optoelectronic modules and network componentsEMCORE CORP·Filed 2007·Granted Apr 5, 2011·9 cites·19 claims
- 0479US7534054B2Embedded parametric monitoring of optoelectronic modulesEMCORE CORP·Filed 2007·Granted May 19, 2009·7 cites·5 claims
- 0565US6270262B1Optical interconnect moduleHARRIS CORP·Filed 1999·Granted Aug 7, 2001·31 cites·30 claims
- 0660US8186891B2Embedded parametric monitoring of optoelectronic modulesHUDGINS CLAY E·Filed 2009·Granted May 29, 2012·4 cites·25 claims
- 0760US7853150B2Identification and authorization of optoelectronic modules by host systemEMCORE CORP·Filed 2007·Granted Dec 14, 2010·2 cites·14 claims
- 0859US7736068B2Wireless tuning and reconfiguration of optoelectronic modulesEMCORE CORP·Filed 2009·Granted Jun 15, 2010·1 cites·15 claims
- 0953US7572067B1Parallel optical connectorEMCORE CORP·Filed 2008·Granted Aug 11, 2009·1 cites·19 claims
- 1047US2011164883A1Reconfiguration and Protocol Adaptation of Optoelectronic Modules and Network ComponentsEMCORE CORP·Filed 2011·Application pending·0 cites
- 1144US2010014868A1Hybrid optical/wireless RF transceiver modules and photonic network componentsEMCORE CORP·Filed 2008·Application pending·0 cites
- 1244US2010202781A1Tunable Optical Transceiver in an XFP PackageEMCORE CORP·Filed 2009·Application pending·0 cites
- 1339US2008031576A1Embedded parametric monitoring of optoelectronic modulesHUDGINS CLAY E·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →