Inventor · disambiguated record
Ah Ram Pyun
Also filed as: PYUN AH RAM
3 granted patents·1 pending application·32 citations·filing 2007–2010
70Inventor score
Top patents by PatentIndex Score
4 records- 0186US8623512B2Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive filmPYUN AH RAM·Filed 2010·Granted Jan 7, 2014·9 cites·16 claims
- 0282US8557896B2Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding filmJEONG CHUL·Filed 2010·Granted Oct 15, 2013·12 cites·19 claims
- 0378US7863758B2Adhesive film composition, associated dicing die bonding film, and die packageCHEIL IND INC·Filed 2007·Granted Jan 4, 2011·11 cites·20 claims
- 0440US2009162650A1Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methodsHONG YONG WOO·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →