Inventor · disambiguated record
Chul-Sik Kim
Also filed as: KIM CHUL-SIK
5 granted patents·1 pending application·26 citations·filing 2004–2011
79Inventor score
Top patents by PatentIndex Score
6 records- 0186US7453156B2Wire bond interconnectionCHIPPAC INC·Filed 2005·Granted Nov 18, 2008·11 cites·22 claims
- 0276US8129263B2Wire bond interconnection and method of manufacture thereofLEE HUN-TEAK·Filed 2011·Granted Mar 6, 2012·3 cites·16 claims
- 0374US7745322B2Wire bond interconnectionCHIPPAC INC·Filed 2008·Granted Jun 29, 2010·4 cites·8 claims
- 0472US9129826B2Epoxy bump for overhang dieLEE HUN TEAK·Filed 2006·Granted Sep 8, 2015·6 cites·17 claims
- 0572US7986047B2Wire bond interconnectionCHIPPAC INC·Filed 2010·Granted Jul 26, 2011·2 cites·9 claims
- 0632US2004237894A1Apparatus having high gas conductanceFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →