Inventor · disambiguated record
Adam Zbrzezny
Also filed as: ZBRZEZNY ADAM · ZBRZEZNY ADAM R
5 granted patents·29 citations·filing 2007–2012
76Inventor score
Top patents by PatentIndex Score
5 records- 0184US8344505B2Wafer level packaging of semiconductor chipsATI TECHNOLOGIES ULC·Filed 2007·Granted Jan 1, 2013·13 cites·20 claims
- 0282US7888259B2Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making sameATI TECHNOLOGIES ULC·Filed 2008·Granted Feb 15, 2011·11 cites·8 claims
- 0369US8313984B2Die substrate with reinforcement structureTOPACIO RODEN·Filed 2008·Granted Nov 20, 2012·4 cites·18 claims
- 0461US8927344B2Die substrate with reinforcement structureTOPACIO RODEN·Filed 2012·Granted Jan 6, 2015·1 cites·20 claims
- 0550US8785317B2Wafer level packaging of semiconductor chipsATI TECHNOLOGIES ULC·Filed 2012·Granted Jul 22, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →