Inventor · disambiguated record
Patrick W. Dehaven
Also filed as: DEHAVEN PATRICK W · DEHAVEN PATRICK WILLIAM
24 granted patents·471 citations·filing 1991–2014
96Inventor score
Top patents by PatentIndex Score
24 records- 0192US9224675B1Automatic capacitance tuning for robust middle of the line contact and silicide applicationsIBM·Filed 2014·Granted Dec 29, 2015·18 cites·20 claims
- 0289US6437440B1Thin film metal barrier for electrical interconnectionsIBM·Filed 2001·Granted Aug 20, 2002·59 cites·15 claims
- 0388US6123825AElectromigration-resistant copper microstructure and process of makingIBM·Filed 1998·Granted Sep 26, 2000·85 cites·25 claims
- 0487US7407875B2Low resistance contact structure and fabrication thereofIBM·Filed 2006·Granted Aug 5, 2008·16 cites·3 claims
- 0586US6291885B1Thin metal barrier for electrical interconnectionsIBM·Filed 1997·Granted Sep 18, 2001·85 cites·24 claims
- 0681US7105360B2Low temperature melt-processing of organic-inorganic hybridIBM·Filed 2002·Granted Sep 12, 2006·15 cites·26 claims
- 0778US8574953B2Low temperature melt-processing of organic-inorganic hybridDEHAVEN PATRICK W·Filed 2012·Granted Nov 5, 2013·4 cites·21 claims
- 0878US6333120B1Method for controlling the texture and microstructure of plated copper and plated structureIBM·Filed 1999·Granted Dec 25, 2001·49 cites·16 claims
- 0974US7951708B2Copper interconnect structure with amorphous tantalum iridium diffusion barrierIBM·Filed 2009·Granted May 31, 2011·5 cites·13 claims
- 1074US6572982B1Electromigration-resistant copper microstructureIBM·Filed 2000·Granted Jun 3, 2003·15 cites·6 claims
- 1174US6126761AProcess of controlling grain growth in metal filmsIBM·Filed 1998·Granted Oct 3, 2000·29 cites·5 claims
- 1270US6916729B2Salicide formation methodIBM·Filed 2003·Granted Jul 12, 2005·16 cites·11 claims
- 1364US5171642AMultilayered intermetallic connection for semiconductor devicesIBM·Filed 1991·Granted Dec 15, 1992·33 cites·9 claims
- 1463US5943601AProcess for fabricating a metallization structureIBM·Filed 1997·Granted Aug 24, 1999·27 cites·22 claims
- 1562US6792075B2Method and apparatus for thin film thickness mappingHYPERNEX INC·Filed 2002·Granted Sep 14, 2004·4 cites·24 claims
- 1652US6509265B1Process for manufacturing a contact barrierIBM·Filed 2000·Granted Jan 21, 2003·4 cites·9 claims
- 1750US8123997B2Low temperature melt-processing of organic-inorganic hybridDEHAVEN PATRICK W·Filed 2008·Granted Feb 28, 2012·0 cites·16 claims
- 1849US7456045B2Low temperature melt-processing of organic-inorganic hybridIBM·Filed 2006·Granted Nov 25, 2008·0 cites·1 claims
- 1949US7291516B2Low temperature melt-processing of organic-inorganic hybridIBM·Filed 2006·Granted Nov 6, 2007·0 cites·22 claims
- 2047US6909772B2Method and apparatus for thin film thickness mappingIBM·Filed 2003·Granted Jun 21, 2005·3 cites·34 claims
- 2145US6638374B2Device produced by a process of controlling grain growth in metal filmsIBM·Filed 2002·Granted Oct 28, 2003·2 cites·7 claims
- 2245US6361627B1Process of controlling grain growth in metal filmsIBM·Filed 2000·Granted Mar 26, 2002·2 cites·9 claims
- 2337US7223691B2Method of forming low resistance and reliable via in inter-level dielectric interconnectIBM·Filed 2004·Granted May 29, 2007·0 cites·10 claims
- 2430US6180521B1Process for manufacturing a contact barrierIBM·Filed 1999·Granted Jan 30, 2001·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →