Inventor · disambiguated record
Jun Hyeong Jang
Also filed as: JANG JUN HYEONG
5 granted patents·1 pending application·3 citations·filing 2020–2021
64Inventor score
Files withSAMSUNG ELECTRO MECH6
Top patents by PatentIndex Score
6 records- 0183US11183462B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0275US11076487B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·1 cites·20 claims
- 0357US11528804B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 13, 2022·0 cites·22 claims
- 0444US12389546B2Printed circuit board, electronic component-embedded substrate, and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 12, 2025·0 cites·13 claims
- 0543US11640952B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted May 2, 2023·0 cites·19 claims
- 0642US2022301975A1Electronic component-embedded substrateSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →