Inventor · disambiguated record
Toshihiko Akahori
Also filed as: AKAHORI TOSHIHIKO
9 granted patents·4 pending applications·265 citations·filing 1991–2006
91Inventor score
Files withHITACHI CHEMICAL CO LTD13
Top patents by PatentIndex Score
13 records- 0186US6783434B1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 1999·Granted Aug 31, 2004·61 cites·23 claims
- 0286US5821016AColored image forming material and color filter obtained therefromHITACHI CHEMICAL CO LTD·Filed 1996·Granted Oct 13, 1998·71 cites·22 claims
- 0370US7163644B2CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jan 16, 2007·8 cites·9 claims
- 0466US5230984APositive type photosensitive anionic electrodeposition coating resin compositionHITACHI CHEMICAL CO LTD·Filed 1991·Granted Jul 27, 1993·33 cites·12 claims
- 0564US5827626AProduction of color filterHITACHI CHEMICAL CO LTD·Filed 1996·Granted Oct 27, 1998·30 cites·9 claims
- 0662US6060215APhotosensitive resin composition and application of its photosensitivityHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 9, 2000·22 cites·15 claims
- 0761US5279923APositive type photosensitive anionic electrodeposition coating resin compositionHITACHI CHEMICAL CO LTD·Filed 1992·Granted Jan 18, 1994·18 cites·9 claims
- 0858US7338751B2Process for producing printed wiring board and photosensitive resin composition used in the sameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Mar 4, 2008·9 cites·33 claims
- 0952US2006197054A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 1052US2006186372A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 1150US5403698ANegative type photosensitive electrodepositing resin compositionHITACHI CHEMICAL CO LTD·Filed 1991·Granted Apr 4, 1995·13 cites·13 claims
- 1250US2005269295A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 1343US2004147206A1CMP abrasive, liquid additive for CMP abrasive and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →