Inventor · disambiguated record
Yoji Tozawa
Also filed as: TOZAWA YOJI
20 granted patents·5 pending applications·102 citations·filing 1994–2024
92Inventor score
Top patents by PatentIndex Score
25 records- 0192US11227721B2Electronic componentTDK CORP·Filed 2017·Granted Jan 18, 2022·4 cites·7 claims
- 0287US7458151B2Method of forming external electrodeTDK CORP·Filed 2005·Granted Dec 2, 2008·19 cites·4 claims
- 0386US7113389B2Surface mounted electronic componentTDK CORP·Filed 2005·Granted Sep 26, 2006·12 cites·2 claims
- 0484US10848119B2Electronic componentTDK CORP·Filed 2018·Granted Nov 24, 2020·2 cites·8 claims
- 0583US7106161B2Coil componentTDK CORP·Filed 2005·Granted Sep 12, 2006·13 cites·8 claims
- 0676US10614946B2Electronic componentTDK CORP·Filed 2017·Granted Apr 7, 2020·1 cites·4 claims
- 0774US8988180B2Multilayer coil componentTDK CORP·Filed 2013·Granted Mar 24, 2015·4 cites·6 claims
- 0872US7673382B2External electrode forming methodTDK CORP·Filed 2006·Granted Mar 9, 2010·5 cites·1 claims
- 0970US11127529B2Method of manufacturing laminated coil componentTDK CORP·Filed 2020·Granted Sep 21, 2021·0 cites·2 claims
- 1068US11894195B2Electronic componentTDK CORP·Filed 2021·Granted Feb 6, 2024·0 cites·9 claims
- 1166US5414300ALid for semiconductor package and package having the lidSUMITOMO METAL CERAMICS INC·Filed 1994·Granted May 9, 1995·37 cites·4 claims
- 1265US2024242883A1Method for manufacturing coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 1363US10665388B2Method of manufacturing laminated coil componentTDK CORP·Filed 2017·Granted May 26, 2020·0 cites·3 claims
- 1463US2024120142A1Electronic componentTDK CORP·Filed 2023·Application pending·0 cites
- 1562US12094642B2Multilayer inductor componentTDK CORP·Filed 2021·Granted Sep 17, 2024·0 cites·16 claims
- 1662US11482365B2Multilayer coil componentTDK CORP·Filed 2020·Granted Oct 25, 2022·0 cites·4 claims
- 1762US7803421B2External electrode forming methodTDK CORP·Filed 2006·Granted Sep 28, 2010·2 cites·8 claims
- 1861US2024128020A1Method for manufacturing laminated coil component, and laminated coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 1960US11631521B2Electronic componentTDK CORP·Filed 2019·Granted Apr 18, 2023·0 cites·6 claims
- 2059US2023317351A1Electronic componentTDK CORP·Filed 2023·Application pending·0 cites
- 2158US8291585B2Method for manufacturing electronic componentONODERA KO·Filed 2008·Granted Oct 23, 2012·3 cites·14 claims
- 2256US12125627B2Multilayer inductor componentTDK CORP·Filed 2021·Granted Oct 22, 2024·0 cites·19 claims
- 2351US8181340B2External electrode forming methodONODERA KO·Filed 2009·Granted May 22, 2012·0 cites·2 claims
- 2441US2007227649A1Method and device for forming external electrodes in electronic chip componentTDK CORP·Filed 2007·Application pending·0 cites
- 2539US10784834B2Lamination type LC filter arrayTDK CORP·Filed 2017·Granted Sep 22, 2020·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →