Inventor · disambiguated record
Chiho Ogihara
Also filed as: OGIHARA CHIHO
3 granted patents·43 citations·filing 2005–2011
65Inventor score
Top patents by PatentIndex Score
3 records- 0191US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0266US8519529B2Semiconductor package with lid bonded on wiring board and method of manufacturing the sameOGIHARA CHIHO·Filed 2011·Granted Aug 27, 2013·4 cites·19 claims
- 0342US8309859B2Method of manufacturing a substrate, substrate, device provided with a substrate, and determining methodOGIHARA CHIHO·Filed 2009·Granted Nov 13, 2012·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →