Inventor · disambiguated record
Hans-Jurgen Hacke
Also filed as: HACKE HANS-JUERGEN · HACKE HANS-JURGEN
8 granted patents·2 pending applications·80 citations·filing 1974–2005
86Inventor score
Top patents by PatentIndex Score
10 records- 0185US3969815AProcess for forming a through connection between a pair of circuit patterns disposed on opposite surfaces of a substrateSIEMENS AG·Filed 1974·Granted Jul 20, 1976·33 cites·10 claims
- 0264US6973717B2Method for producing a semiconductor device in chip formatINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 13, 2005·12 cites·3 claims
- 0363US6946725B2Electronic device having microscopically small contact areas and methods for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 20, 2005·11 cites·19 claims
- 0452US6969917B2Electronic chip component with an integrated circuit and fabrication methodINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 29, 2005·4 cites·54 claims
- 0546US6818090B2Semiconductor device in chip format and method for producing itINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 16, 2004·3 cites·10 claims
- 0644US5043296AMethod of manufacturing LED rows using a temporary rigid auxiliary carrierSIEMENS AG·Filed 1988·Granted Aug 27, 1991·14 cites·18 claims
- 0743US6930383B2Electronic component including a housing and a substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 16, 2005·3 cites·11 claims
- 0843US2005255633A1Methods for producing an electronic device having microscopically small contact areasINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 0934US2001050566A1Printed circuit board for use in the testing of electrical components and method for producing itFiled 2001·Application pending·0 cites
- 1033US6506631B2Method for manufacturing integrated circuits and semiconductor wafer which has integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jan 14, 2003·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Hans-Jurgen Hacke files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →