Inventor · disambiguated record
Ryota Horiike
Also filed as: HORIIKE Ryota
9 granted patents·3 pending applications·7 citations·filing 2016–2025
80Inventor score
Technology areasH10P
Top patents by PatentIndex Score
12 records- 0186US10229829B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·3 cites·2 claims
- 0283US2025349541A1Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0382US11587788B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 21, 2023·1 cites·19 claims
- 0480US10163625B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 25, 2018·2 cites·11 claims
- 0577US12381079B2Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 0669US10096463B2Method of manufacturing semiconductor device, substrate processing apparatus comprising exhaust port and multiple nozzles, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 9, 2018·1 cites·15 claims
- 0769US2025305125A1Substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0861US10497561B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 3, 2019·0 cites·15 claims
- 0958US12359314B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 15, 2025·0 cites·17 claims
- 1057US2025223690A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1146US10199219B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Feb 5, 2019·0 cites·13 claims
- 1245US10176988B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jan 8, 2019·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Ryota Horiike files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →