Inventor · disambiguated record
Paul T. Lin
Also filed as: LIN PAUL · LIN PAUL T
45 granted patents·1 pending application·8,027 citations·filing 1975–2011
99Inventor score
Files withMOTOROLA INC33LIN PAUL T4CAMBRIDGE MEMORIES1KULICKE & SOFFA IND INC1KULICKE & SOFFA INVESTMENTS1
Top patents by PatentIndex Score
46 records- 0199US5436203AShielded liquid encapsulated semiconductor device and method for making the sameMOTOROLA INC·Filed 1994·Granted Jul 25, 1995·407 cites·12 claims
- 0299US5273938AMethod for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer filmMOTOROLA INC·Filed 1992·Granted Dec 28, 1993·420 cites·14 claims
- 0399US5239198AOvermolded semiconductor device having solder ball and edge lead connective structureMOTOROLA INC·Filed 1992·Granted Aug 24, 1993·482 cites·35 claims
- 0499US5222014AThree-dimensional multi-chip pad array carrierMOTOROLA INC·Filed 1992·Granted Jun 22, 1993·874 cites·17 claims
- 0599US5216278ASemiconductor device having a pad array carrier packageMOTOROLA INC·Filed 1992·Granted Jun 1, 1993·844 cites·38 claims
- 0698US5508556ALeaded semiconductor device having accessible power supply pad terminalsMOTOROLA INC·Filed 1994·Granted Apr 16, 1996·308 cites·19 claims
- 0798US5468999ALiquid encapsulated ball grid array semiconductor device with fine pitch wire bondingMOTOROLA INC·Filed 1994·Granted Nov 21, 1995·357 cites·21 claims
- 0898US5450283AThermally enhanced semiconductor device having exposed backside and method for making the sameMOTOROLA INC·Filed 1994·Granted Sep 12, 1995·368 cites·20 claims
- 0998US5258648AComposite flip chip semiconductor device with an interposer having test contacts formed along its peripheryMOTOROLA INC·Filed 1992·Granted Nov 2, 1993·417 cites·15 claims
- 1098US5157480ASemiconductor device having dual electrical contact sitesMOTOROLA INC·Filed 1991·Granted Oct 20, 1992·427 cites·15 claims
- 1198US5045921APad array carrier IC device using flexible tapeMOTOROLA INC·Filed 1989·Granted Sep 3, 1991·306 cites·6 claims
- 1297US5247423AStacking three dimensional leadless multi-chip module and method for making the sameMOTOROLA INC·Filed 1992·Granted Sep 21, 1993·274 cites·12 claims
- 1397US5219117AMethod of transferring solder balls onto a semiconductor deviceMOTOROLA INC·Filed 1991·Granted Jun 15, 1993·153 cites·15 claims
- 1497US5012386AHigh performance overmolded electronic packageMOTOROLA INC·Filed 1989·Granted Apr 30, 1991·213 cites·24 claims
- 1595US5200362AMethod of attaching conductive traces to an encapsulated semiconductor die using a removable transfer filmMOTOROLA INC·Filed 1991·Granted Apr 6, 1993·500 cites·8 claims
- 1692US6093969AFace-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modulesFiled 1999·Granted Jul 25, 2000·130 cites·10 claims
- 1790US7667338B2Package with solder-filled via holes in molding layersLIN PAUL T·Filed 2007·Granted Feb 23, 2010·21 cites·25 claims
- 1890US4791075AProcess for making a hermetic low cost pin grid array packageMOTOROLA INC·Filed 1987·Granted Dec 13, 1988·90 cites·19 claims
- 1990US4038488AMultilayer ceramic multi-chip, dual in-line packaging assemblyCAMBRIDGE MEMORIES·Filed 1975·Granted Jul 26, 1977·76 cites·11 claims
- 2089US6992001B1Screen print under-bump metalization (UBM) to produce low cost flip chip substrateKULICKE & SOFFA IND INC·Filed 2003·Granted Jan 31, 2006·55 cites·18 claims
- 2189US6301121B1Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing processFiled 1999·Granted Oct 9, 2001·74 cites·12 claims
- 2288US4672421ASemiconductor packaging and methodMOTOROLA INC·Filed 1986·Granted Jun 9, 1987·79 cites·21 claims
- 2387US6249052B1Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configurationFiled 1999·Granted Jun 19, 2001·92 cites·21 claims
- 2487US5216283ASemiconductor device having an insertable heat sink and method for mounting the sameMOTOROLA INC·Filed 1990·Granted Jun 1, 1993·95 cites·8 claims
- 2587US5006922APackaged semiconductor device having a low cost ceramic PGA packageMOTOROLA INC·Filed 1990·Granted Apr 9, 1991·93 cites·22 claims
- 2686US6369451B2Solder balls and columns with stratified underfills on substrate for flip chip joiningFiled 1999·Granted Apr 9, 2002·80 cites·15 claims
- 2785US7408253B2Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing densityLIN PAUL T·Filed 2005·Granted Aug 5, 2008·14 cites·6 claims
- 2884US6002178AMultiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP)Filed 1997·Granted Dec 14, 1999·74 cites·11 claims
- 2984US5280193ARepairable semiconductor multi-package module having individualized package bodies on a PC board substrateLIN PAUL T·Filed 1992·Granted Jan 18, 1994·83 cites·5 claims
- 3082US6677668B1Configuration for testing a substrate mounted with a most performance-demanding integrated circuitFiled 2000·Granted Jan 13, 2004·26 cites·10 claims
- 3182US5329158ASurface mountable semiconductor device having self loaded solder jointsMOTOROLA INC·Filed 1992·Granted Jul 12, 1994·68 cites·16 claims
- 3282US5018005AThin, molded, surface mount electronic deviceMOTOROLA INC·Filed 1989·Granted May 21, 1991·57 cites·15 claims
- 3380US5114880AMethod for fabricating multiple electronic devices within a single carrier structureMOTOROLA INC·Filed 1991·Granted May 19, 1992·62 cites·10 claims
- 3479US5045914APlastic pad array electronic AC deviceMOTOROLA INC·Filed 1991·Granted Sep 3, 1991·63 cites·17 claims
- 3578US4837184AProcess of making an electronic device package with peripheral carrier structure of low-cost plasticMOTOROLA INC·Filed 1988·Granted Jun 6, 1989·54 cites·19 claims
- 3677US5053357AMethod of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereonMOTOROLA INC·Filed 1990·Granted Oct 1, 1991·57 cites·6 claims
- 3776US5300187AMethod of removing contaminantsMOTOROLA INC·Filed 1992·Granted Apr 5, 1994·66 cites·22 claims
- 3869US4380866AMethod of programming ROM by offset masking of selected gatesMOTOROLA INC·Filed 1981·Granted Apr 26, 1983·22 cites·8 claims
- 3964US6784556B2Design of interconnection pads with separated probing and wire bonding regionsKULICKE & SOFFA INVESTMENTS·Filed 2002·Granted Aug 31, 2004·11 cites·9 claims
- 4064US5049526AMethod for fabricating semiconductor device including packageMOTOROLA INC·Filed 1989·Granted Sep 17, 1991·28 cites·7 claims
- 4164US4897602AElectronic device package with peripheral carrier structure of low-cost plasticMOTOROLA INC·Filed 1988·Granted Jan 30, 1990·34 cites·16 claims
- 4259US4661887ASurface mountable integrated circuit packages having solder bearing leadsMOTOROLA INC·Filed 1985·Granted Apr 28, 1987·17 cites·32 claims
- 4356US5378657AMethod for making an aluminum clad leadframe and a semiconductor device employing the sameMOTOROLA INC·Filed 1994·Granted Jan 3, 1995·20 cites·16 claims
- 4456US5036381AMultiple electronic devices within a single carrier structureMOTOROLA INC·Filed 1990·Granted Jul 30, 1991·24 cites·13 claims
- 4546US5329159ASemiconductor device employing an aluminum clad leadframeMOTOROLA INC·Filed 1993·Granted Jul 12, 1994·12 cites·11 claims
- 4639US2012020040A1Package-to-package stacking by using interposer with traces, and or standoffs and solder ballsLIN PAUL T·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →