Inventor · disambiguated record
Helmut Prengel
Also filed as: PRENGEL HELMUT · PRENGEL HELMUT W
2 granted patents·2 pending applications·31 citations·filing 2005–2008
61Inventor score
Top patents by PatentIndex Score
4 records- 0186US7286384B2Automatic resource assignment in stacked module devicesSPANSION LLC·Filed 2005·Granted Oct 23, 2007·22 cites·22 claims
- 0276US7271495B2Chip bond layout for chip carrier for flip chip applicationsADVANCED MICRO DEVICES INC·Filed 2005·Granted Sep 18, 2007·9 cites·21 claims
- 0346US2010162256A1Optimization of application power consumption and performance in an integrated system on a chipBRANOVER ALEXANDER·Filed 2008·Application pending·0 cites
- 0439US2006206745A1Automatic resource assignment in devices having stacked modulesADVANCED MICRO DEVICES INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →