Inventor · disambiguated record
Igor Y. Khandros
Also filed as: KHANDROS IGOR · KHANDROS IGOR Y · KHANDROS IGOR Y JR · KHANDROS IGOR YAN
200 granted patents·33 pending applications·26,067 citations·filing 1981–2023
99Inventor score
Top patents by PatentIndex Score
233 records- 0199US7225538B2Resilient contact structures formed and then attached to a substrateFORMFACTOR INC·Filed 2001·Granted Jun 5, 2007·206 cites·49 claims
- 0299US6913468B2Methods of removably mounting electronic components to a circuit board, and sockets formed by the methodsFORMFACTOR INC·Filed 2003·Granted Jul 5, 2005·154 cites·26 claims
- 0399US6838893B2Probe card assemblyFORMFACTOR INC·Filed 2003·Granted Jan 4, 2005·155 cites·19 claims
- 0499US6835898B2Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structuresFORMFACTOR INC·Filed 2000·Granted Dec 28, 2004·174 cites·5 claims
- 0599US6778406B2Resilient contact structures for interconnecting electronic devicesFORMFACTOR INC·Filed 2000·Granted Aug 17, 2004·247 cites·23 claims
- 0699US6741085B1Contact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 1997·Granted May 25, 2004·175 cites·19 claims
- 0799US6729019B2Method of manufacturing a probe cardFORMFACTOR INC·Filed 2001·Granted May 4, 2004·185 cites·24 claims
- 0899US6690185B1Large contactor with multiple, aligned contactor unitsFORMFACTOR INC·Filed 1998·Granted Feb 10, 2004·268 cites·8 claims
- 0999US6525555B1Wafer-level burn-in and testFORMFACTOR INC·Filed 2000·Granted Feb 25, 2003·164 cites·52 claims
- 1099US6482013B2Microelectronic spring contact element and electronic component having a plurality of spring contact elementsFORMFACTOR INC·Filed 1997·Granted Nov 19, 2002·272 cites·14 claims
- 1199US6336269B1Method of fabricating an interconnection elementFiled 1995·Granted Jan 8, 2002·532 cites·23 claims
- 1299US6110823AMethod of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a methodFORMFACTOR INC·Filed 1998·Granted Aug 29, 2000·299 cites·40 claims
- 1399US6064213AWafer-level burn-in and testFORMFACTOR INC·Filed 1997·Granted May 16, 2000·416 cites·56 claims
- 1499US6050829AMaking discrete power connections to a space transformer of a probe card assemblyFORMFACTOR INC·Filed 1997·Granted Apr 18, 2000·252 cites·3 claims
- 1599US6032356AWafer-level test and burn-in, and semiconductor processFORMFACTOR INC·Filed 1997·Granted Mar 7, 2000·275 cites·19 claims
- 1699US6029344AComposite interconnection element for microelectronic components, and method of making sameFORMFACTOR INC·Filed 1998·Granted Feb 29, 2000·373 cites·15 claims
- 1799US5994152AFabricating interconnects and tips using sacrificial substratesFORMFACTOR INC·Filed 1997·Granted Nov 30, 1999·409 cites·60 claims
- 1899US5974662AMethod of planarizing tips of probe elements of a probe card assemblyFORMFACTOR INC·Filed 1995·Granted Nov 2, 1999·649 cites·35 claims
- 1999US5917707AFlexible contact structure with an electrically conductive shellFORMFACTOR INC·Filed 1994·Granted Jun 29, 1999·556 cites·13 claims
- 2099US5864946AMethod of making contact tip structuresFORMFACTOR INC·Filed 1997·Granted Feb 2, 1999·289 cites·12 claims
- 2199US5832601AMethod of making temporary connections between electronic componentsFORMFACTOR INC·Filed 1997·Granted Nov 10, 1998·264 cites·11 claims
- 2299US5829128AMethod of mounting resilient contact structures to semiconductor devicesFORMFACTOR INC·Filed 1995·Granted Nov 3, 1998·362 cites·20 claims
- 2399US5806181AContact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 1997·Granted Sep 15, 1998·452 cites·21 claims
- 2499US5772451ASockets for electronic components and methods of connecting to electronic componentsFORMFACTOR INC·Filed 1995·Granted Jun 30, 1998·648 cites·92 claims
- 2599US5679977ASemiconductor chip assemblies, methods of making same and components for sameTESSERA INC·Filed 1993·Granted Oct 21, 1997·575 cites·27 claims
- 2699US5476211AMethod of manufacturing electrical contacts, using a sacrificial memberFORMFACTOR INC·Filed 1993·Granted Dec 19, 1995·670 cites·69 claims
- 2799US5347159ASemiconductor chip assemblies with face-up mounting and rear-surface connection to substrateTESSERA INC·Filed 1991·Granted Sep 13, 1994·351 cites·27 claims
- 2899US5258330ASemiconductor chip assemblies with fan-in leadsTESSERA INC·Filed 1993·Granted Nov 2, 1993·222 cites·16 claims
- 2998US8373428B2Probe card assembly and kit, and methods of making sameFORMFACTOR INC·Filed 2009·Granted Feb 12, 2013·75 cites·22 claims
- 3098US6836962B2Method and apparatus for shaping spring elementsFORMFACTOR INC·Filed 2000·Granted Jan 4, 2005·148 cites·5 claims
- 3198US6788094B2Wafer-level burn-in and testFORMFACTOR INC·Filed 2002·Granted Sep 7, 2004·95 cites·21 claims
- 3298US6727579B1Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structuresFORMFACTOR INC·Filed 2000·Granted Apr 27, 2004·203 cites·12 claims
- 3398US6701612B2Method and apparatus for shaping spring elementsFORMFACTOR INC·Filed 2000·Granted Mar 9, 2004·135 cites·38 claims
- 3498US6669489B1Interposer, socket and assembly for socketing an electronic component and method of making and using sameFORMFACTOR INC·Filed 1998·Granted Dec 30, 2003·166 cites·21 claims
- 3598US6624648B2Probe card assemblyFORMFACTOR INC·Filed 2001·Granted Sep 23, 2003·176 cites·36 claims
- 3698US6615485B2Probe card assembly and kit, and methods of making sameFORMFACTOR INC·Filed 2001·Granted Sep 9, 2003·127 cites·43 claims
- 3798US6538214B2Method for manufacturing raised electrical contact pattern of controlled geometryFORMFACTOR INC·Filed 2001·Granted Mar 25, 2003·114 cites·30 claims
- 3898US6534856B1Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2001·Granted Mar 18, 2003·138 cites·29 claims
- 3998US6520778B1Microelectronic contact structures, and methods of making sameFORMFACTOR INC·Filed 1998·Granted Feb 18, 2003·328 cites·15 claims
- 4098US6475822B2Method of making microelectronic contact structuresFORMFACTOR INC·Filed 2000·Granted Nov 5, 2002·123 cites·18 claims
- 4198US6465893B1Stacked chip assemblyTESSERA INC·Filed 2000·Granted Oct 15, 2002·152 cites·66 claims
- 4298US6441315B1Contact structures with blades having a wiping motionFORMFACTOR INC·Filed 1998·Granted Aug 27, 2002·222 cites·45 claims
- 4398US6246247B1Probe card assembly and kit, and methods of using sameFORMFACTOR INC·Filed 1998·Granted Jun 12, 2001·180 cites·51 claims
- 4498US6215670B1Method for manufacturing raised electrical contact pattern of controlled geometryFORMFACTOR INC·Filed 1999·Granted Apr 10, 2001·233 cites·28 claims
- 4598US6184053B1Method of making microelectronic spring contact elementsFORMFACTOR INC·Filed 1997·Granted Feb 6, 2001·372 cites·21 claims
- 4698US5926951AMethod of stacking electronic componentsFORMFACTOR INC·Filed 1996·Granted Jul 27, 1999·231 cites·19 claims
- 4798US5900738AContact structure device for interconnections, interposer, semiconductor assembly and package using the same and methodFORMFACTOR INC·Filed 1996·Granted May 4, 1999·221 cites·17 claims
- 4898US5884398AMounting spring elements on semiconductor devicesFORMFACTOR INC·Filed 1997·Granted Mar 23, 1999·166 cites·18 claims
- 4998US5536909ASemiconductor connection components and methods with releasable lead supportTESSERA INC·Filed 1994·Granted Jul 16, 1996·254 cites·27 claims
- 5098US5282312AMulti-layer circuit construction methods with customization featuresTESSERA INC·Filed 1991·Granted Feb 1, 1994·248 cites·20 claims
Showing the top 50 of 233 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →