Inventor · disambiguated record
Keith Donegan
Also filed as: DONEGAN KEITH · DONEGAN KEITH P
12 granted patents·12 citations·filing 2013–2023
83Inventor score
Top patents by PatentIndex Score
12 records- 0187US11719895B1Spot-size converters with angled facetsGLOBALFOUNDRIES US INC·Filed 2022·Granted Aug 8, 2023·1 cites·20 claims
- 0283US10199270B2Multi-directional self-aligned multiple patterningGLOBALFOUNDRIES INC·Filed 2017·Granted Feb 5, 2019·5 cites·20 claims
- 0377US11121087B2Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC productGLOBALFOUNDRIES US INC·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
- 0471US10566231B2Interconnect formation with chamferless via, and related interconnectGLOBALFOUNDRIES INC·Filed 2018·Granted Feb 18, 2020·2 cites·14 claims
- 0571US10510675B2Substrate structure with spatial arrangement configured for coupling of surface plasmons to incident lightGLOBALFOUNDRIES INC·Filed 2018·Granted Dec 17, 2019·2 cites·7 claims
- 0664US12487408B2Reference markers adjacent to a cavity in a photonics chipGLOBALFOUNDRIES US INC·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 0762US12449615B2Calibration markers for a photonics chipGLOBALFOUNDRIES US INC·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 0852US12461312B2Cladding structure in the back end of line of photonics chipsGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 4, 2025·0 cites·17 claims
- 0946US11158574B2Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC productGLOBALFOUNDRIES US INC·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 1044US10651046B2Multiple patterning with late lithographically-defined mandrel cutsGLOBALFOUNDRIES INC·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 1143US11417525B2Multiple patterning with mandrel cuts defined by block masksGLOBALFOUNDRIES US INC·Filed 2018·Granted Aug 16, 2022·0 cites·8 claims
- 1243US9287109B2Methods of forming a protection layer to protect a metal hard mask layer during lithography reworking processesGLOBALFOUNDRIES INC·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
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