Inventor · disambiguated record
Kevin Jin
Also filed as: JIN KEVIN
5 granted patents·2 pending applications·19 citations·filing 2001–2015
71Inventor score
Top patents by PatentIndex Score
7 records- 0172US9781977B2Interlocking web connectors for occupant restraint systems and associated methods of use and manufactureSHIELD RESTRAINT SYSTEMS INC·Filed 2015·Granted Oct 10, 2017·3 cites·16 claims
- 0265US7056767B2Method and apparatus for flip chip device assembly by radiant heatingTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 6, 2006·16 cites·3 claims
- 0353US9272302B2Mixing apparatus for mixing bonding adhesive at die bonder before dispenseTEXAS INSTRUMENTS INC·Filed 2013·Granted Mar 1, 2016·0 cites·5 claims
- 0452US8668794B2Mixing bonding adhesive at die bonder before dispenseYU FRANK·Filed 2011·Granted Mar 11, 2014·0 cites·9 claims
- 0542US8008131B2Semiconductor chip package assembly method and apparatus for countering leadfinger deformationTEXAS INSTRUMENTS INC·Filed 2008·Granted Aug 30, 2011·0 cites·15 claims
- 0634US2008073028A1Methods and apparatus to dispense adhesive for semiconductor packagingYU FRANK·Filed 2006·Application pending·0 cites
- 0729US2003132528A1Method and apparatus for flip chip device assembly by radiant heatingFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →