Inventor · disambiguated record
Anilkumar C. Bhatt
Also filed as: BHATT ANILKUMAR C · BHATT ANILKUMAR CHINUPRASAD
51 granted patents·2,206 citations·filing 1983–2003
99Inventor score
Files withIBM51
Top patents by PatentIndex Score
51 records- 0198US5487218AMethod for making printed circuit boards with selectivity filled plated through holesIBM·Filed 1994·Granted Jan 30, 1996·284 cites·2 claims
- 0297US6608757B1Method for making a printed wiring boardIBM·Filed 2002·Granted Aug 19, 2003·120 cites·12 claims
- 0397US6386890B1Printed circuit board to module mounting and interconnecting structure and methodIBM·Filed 2001·Granted May 14, 2002·129 cites·22 claims
- 0497US5822856AManufacturing circuit board assemblies having filled viasIBM·Filed 1996·Granted Oct 20, 1998·223 cites·10 claims
- 0596US6664485B2Full additive process with filled plated through holesIBM·Filed 2001·Granted Dec 16, 2003·66 cites·19 claims
- 0696US6178093B1Information handling system with circuit assembly having holes filled with filler materialIBM·Filed 1998·Granted Jan 23, 2001·168 cites·33 claims
- 0794US6268016B1Manufacturing computer systems with fine line circuitized substratesIBM·Filed 1996·Granted Jul 31, 2001·89 cites·21 claims
- 0894US5557844AMethod of preparing a printed circuit boardIBM·Filed 1995·Granted Sep 24, 1996·138 cites·1 claims
- 0994US5268260APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1991·Granted Dec 7, 1993·102 cites·3 claims
- 1091US4579772AGlass cloth for printed circuits and method of manufacture wherein yarns have a substantially elliptical cross-sectionIBM·Filed 1983·Granted Apr 1, 1986·26 cites·6 claims
- 1190US6453549B1Method of filling plated through holesIBM·Filed 1999·Granted Sep 24, 2002·73 cites·12 claims
- 1290US5156730AElectrode array and use thereofIBM·Filed 1991·Granted Oct 20, 1992·107 cites·5 claims
- 1384US4749614AProcess for coating fibers, use thereof, and productIBM·Filed 1986·Granted Jun 7, 1988·64 cites·29 claims
- 1483US6418616B2Full additive process with filled plated through holesIBM·Filed 2001·Granted Jul 16, 2002·24 cites·5 claims
- 1582US6000129AProcess for manufacturing a circuit with filled holesIBM·Filed 1998·Granted Dec 14, 1999·43 cites·4 claims
- 1680US6195883B1Full additive process with filled plated through holesIBM·Filed 1998·Granted Mar 6, 2001·37 cites·3 claims
- 1779US6138350AProcess for manufacturing a circuit board with filled holesIBM·Filed 1998·Granted Oct 31, 2000·37 cites·12 claims
- 1875US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 1972US5994597AProcess for recovering high boiling solvents from a photolithographic waste stream comprising less than 10 percent by weight monomeric unitsIBM·Filed 1998·Granted Nov 30, 1999·13 cites·24 claims
- 2071US6423290B1Method for recovering an organic solvent from an acidic waste stream such as in integrated chip manufacturingIBM·Filed 2000·Granted Jul 23, 2002·11 cites·16 claims
- 2171US5981880AElectronic device packages having glass free non conductive layersIBM·Filed 1996·Granted Nov 9, 1999·33 cites·3 claims
- 2270US6436803B2Manufacturing computer systems with fine line circuitized substratesIBM·Filed 2001·Granted Aug 20, 2002·11 cites·33 claims
- 2370US6127097APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1997·Granted Oct 3, 2000·27 cites·5 claims
- 2470US4563385AHybrid glass cloth for printed circuit boardsIBM·Filed 1984·Granted Jan 7, 1986·21 cites·6 claims
- 2569US6127025ACircuit board with wiring sealing filled holesIBM·Filed 1998·Granted Oct 3, 2000·23 cites·24 claims
- 2668US6414509B1Method and apparatus for in-situ testing of integrated circuit chipsIBM·Filed 2000·Granted Jul 2, 2002·18 cites·5 claims
- 2768US5707893AMethod of making a circuitized substrate using two different metallization processesIBM·Filed 1995·Granted Jan 13, 1998·26 cites·15 claims
- 2866US6225028B1Method of making an enhanced organic chip carrier packageIBM·Filed 2000·Granted May 1, 2001·12 cites·34 claims
- 2965US6221694B1Method of making a circuitized substrate with an apertureIBM·Filed 1999·Granted Apr 24, 2001·31 cites·13 claims
- 3063US5281723APropylene carbonate recovery processIBM·Filed 1992·Granted Jan 25, 1994·8 cites·47 claims
- 3162US4971715APhenolic-free stripping composition and use thereofIBM·Filed 1988·Granted Nov 20, 1990·18 cites·18 claims
- 3260US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 3360US5953594AMethod of making a circuitized substrate for chip carrier structureIBM·Filed 1997·Granted Sep 14, 1999·27 cites·21 claims
- 3458US6569604B1Blind via formation in a photoimageable dielectric materialIBM·Filed 1999·Granted May 27, 2003·18 cites·22 claims
- 3556US6114019ACircuit board assemblies having filled vias free from bleed-outIBM·Filed 1998·Granted Sep 5, 2000·13 cites·23 claims
- 3654US6781064B1Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming sameIBM·Filed 1999·Granted Aug 24, 2004·16 cites·25 claims
- 3754US5637442AMethod for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcoholIBM·Filed 1995·Granted Jun 10, 1997·14 cites·2 claims
- 3851US5311660AMethyl chloroform-free desmear process in additive circuitizationIBM·Filed 1993·Granted May 17, 1994·17 cites·10 claims
- 3949US6699350B2Dielectric structure and method of formationIBM·Filed 2002·Granted Mar 2, 2004·2 cites·22 claims
- 4049US6495239B1Dielectric structure and method of formationIBM·Filed 1999·Granted Dec 17, 2002·13 cites·6 claims
- 4149US6207354B1Method of making an organic chip carrier packageIBM·Filed 1999·Granted Mar 27, 2001·16 cites·14 claims
- 4248US5310428ASolvent stabilization process and method of recovering solventIBM·Filed 1992·Granted May 10, 1994·10 cites·5 claims
- 4347US6740819B2Printed wiring boardIBM·Filed 2003·Granted May 25, 2004·1 cites·8 claims
- 4447US6110650AMethod of making a circuitized substrateIBM·Filed 1998·Granted Aug 29, 2000·12 cites·34 claims
- 4546US6187965B1Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric unitsIBM·Filed 1998·Granted Feb 13, 2001·14 cites·24 claims
- 4644US5922517AMethod of preparing a substrate surface for conformal platingIBM·Filed 1996·Granted Jul 13, 1999·9 cites·9 claims
- 4742US6255208B1Selective wafer-level testing and burn-inIBM·Filed 1999·Granted Jul 3, 2001·10 cites·18 claims
- 4841US6946055B2Method for recovering an organic solvent from a waste stream containing supercritical CO2IBM·Filed 2001·Granted Sep 20, 2005·0 cites·20 claims
- 4938USRE37840EMethod of preparing a printed circuit boardIBM·Filed 1998·Granted Sep 17, 2002·5 cites·23 claims
- 5036US5905018AMethod of preparing a substrate surface for conformal platingIBM·Filed 1997·Granted May 18, 1999·3 cites·11 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Anilkumar C. Bhatt files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →