Inventor · disambiguated record
Zi-Xian Zhan
Also filed as: ZHAN ZI-XIAN
2 granted patents·1 pending application·0 citations·filing 2021–2024
25Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC3
Top patents by PatentIndex Score
3 records- 0170US2024274570A1Stud bump for wirebonding high voltage isolation barrier connectionTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0263US11973052B2Stud bump for wirebonding high voltage isolation barrier connectionTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0350US11848297B2Semiconductor device packages with high angle wire bonding and non-gold bond wiresTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →