Inventor · disambiguated record
Je-Hsiung Lan
Also filed as: LAN JE-HSIUNG · LAN JE-HSIUNG JEFFREY
83 granted patents·51 pending applications·423 citations·filing 2002–2025
99Inventor score
Files withQUALCOMM INC109LAN JE-HSIUNG7QUALCOMM MEMS TECHNOLOGIES INC7BLACK JUSTIN PHELPS2KIM JONGHAE2
Top patents by PatentIndex Score
134 records- 0198US11158590B1Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)QUALCOMM INC·Filed 2020·Granted Oct 26, 2021·12 cites·20 claims
- 0298US9449753B2Varying thickness inductorQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·33 cites·25 claims
- 0396US9502586B1Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2015·Granted Nov 22, 2016·13 cites·18 claims
- 0495US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 0595US7317434B2Circuits including switches for electronic devices and methods of using the electronic devicesDUPONT DISPLAYS INC·Filed 2004·Granted Jan 8, 2008·98 cites·23 claims
- 0694US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 0794US7643199B2High aperture-ratio top-reflective AM-iMod displaysQUALCOMM MEMS TECHNOLOGIES INC·Filed 2007·Granted Jan 5, 2010·48 cites·37 claims
- 0893US9721946B2Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2016·Granted Aug 1, 2017·7 cites·10 claims
- 0993US7660028B2Apparatus and method of dual-mode displayQUALCOMM MEMS TECHNOLOGIES INC·Filed 2008·Granted Feb 9, 2010·29 cites·29 claims
- 1092US9001031B2Complex passive design with special via implementationLO CHI SHUN·Filed 2012·Granted Apr 7, 2015·17 cites·34 claims
- 1191US11984874B2Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted May 14, 2024·2 cites·33 claims
- 1290US9673275B2Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuitsQUALCOMM INC·Filed 2015·Granted Jun 6, 2017·6 cites·18 claims
- 1390US8492874B2High density metal-insulator-metal trench capacitorLAN JE-HSIUNG·Filed 2011·Granted Jul 23, 2013·14 cites·25 claims
- 1488US11336251B2Device with 3D inductor and magnetic core in substrateQUALCOMM INC·Filed 2020·Granted May 17, 2022·2 cites·29 claims
- 1588US8363380B2MEMS varactorsQUALCOMM INC·Filed 2009·Granted Jan 29, 2013·13 cites·25 claims
- 1687US12046530B2Thermal bridge interposer structureQUALCOMM INC·Filed 2021·Granted Jul 23, 2024·1 cites·28 claims
- 1787US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 1887US9425761B2High pass filters and low pass filters using through glass via technologyQUALCOMM INC·Filed 2013·Granted Aug 23, 2016·9 cites·21 claims
- 1987US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 2086US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 2186US9431473B2Hybrid transformer structure on semiconductor devicesQUALCOMM INC·Filed 2012·Granted Aug 30, 2016·7 cites·48 claims
- 2286US8970516B2Integrated passives and power amplifierBLACK JUSTIN PHELPS·Filed 2011·Granted Mar 3, 2015·11 cites·47 claims
- 2385US10002700B2Vertical-coupling transformer with an air-gap structureQUALCOMM INC·Filed 2013·Granted Jun 19, 2018·7 cites·38 claims
- 2484US9875848B2MIM capacitor and method of making the sameQUALCOMM INC·Filed 2015·Granted Jan 23, 2018·4 cites·30 claims
- 2583US9813043B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·3 cites·23 claims
- 2683US9768109B2Integrated circuits (ICS) on a glass substrateQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·3 cites·20 claims
- 2783US9355967B2Stress compensation patterningQUALCOMM INC·Filed 2013·Granted May 31, 2016·5 cites·31 claims
- 2882US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 2978US12334903B2Substrate comprising acoustic resonators configured as at least one acoustic filterQUALCOMM INC·Filed 2020·Granted Jun 17, 2025·1 cites·19 claims
- 3078US8093982B2Three dimensional inductor and transformer design methodology of glass technologyKIM JONGHAE·Filed 2010·Granted Jan 10, 2012·5 cites·23 claims
- 3177US7782522B2Encapsulation methods for interferometric modulator and MEMS devicesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2008·Granted Aug 24, 2010·6 cites·34 claims
- 3276US11393789B2Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bondingQUALCOMM INC·Filed 2019·Granted Jul 19, 2022·2 cites·30 claims
- 3376US9906318B2Frequency multiplexerQUALCOMM INC·Filed 2015·Granted Feb 27, 2018·3 cites·24 claims
- 3476US9090499B2Method and apparatus for light induced etching of glass substrates in the fabrication of electronic circuitsQUALCOMM INC·Filed 2013·Granted Jul 28, 2015·3 cites·24 claims
- 3575US9634640B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2013·Granted Apr 25, 2017·3 cites·19 claims
- 3674US8471643B2Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generationKIM JONGHAE·Filed 2011·Granted Jun 25, 2013·4 cites·24 claims
- 3773US8023169B2Apparatus and method of dual-mode displayQUALCOMM MEMS TECHNOLOGIES INC·Filed 2010·Granted Sep 20, 2011·2 cites·28 claims
- 3872US8922974B2MEMS varactorsQUALCOMM INC·Filed 2013·Granted Dec 30, 2014·2 cites·18 claims
- 3971US10171112B2RF multiplexer with integrated directional couplersQUALCOMM INC·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 4069US9136574B2Compact 3-D coplanar transmission linesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 4169US2025210852A1Antenna modules employing three-dimensional (3d) build-up on mold package to support efficient integration of radio-frequency (rf) circuitry, and related fabrication methodsQUALCOMM INC·Filed 2025·Application pending·0 cites
- 4268US10038422B2Single-chip multi-frequency film bulk acoustic-wave resonatorsQUALCOMM INC·Filed 2016·Granted Jul 31, 2018·1 cites·20 claims
- 4367US12255381B2Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methodsQUALCOMM INC·Filed 2022·Granted Mar 18, 2025·0 cites·23 claims
- 4464US9922956B2Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integrationQUALCOMM INC·Filed 2014·Granted Mar 20, 2018·1 cites·19 claims
- 4564US9634645B2Integration of a replica circuit and a transformer above a dielectric substrateQUALCOMM INC·Filed 2013·Granted Apr 25, 2017·1 cites·34 claims
- 4664US8022896B2ESD protection for MEMS display panelsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2007·Granted Sep 20, 2011·1 cites·42 claims
- 4763US12512593B2Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methodsQUALCOMM INC·Filed 2023·Granted Dec 30, 2025·0 cites·38 claims
- 4863US10607980B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2018·Granted Mar 31, 2020·0 cites·20 claims
- 4963US10074625B2Wafer level package (WLP) ball support using cavity structureQUALCOMM INC·Filed 2015·Granted Sep 11, 2018·1 cites·18 claims
- 5062US12206155B2Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit packageQUALCOMM INC·Filed 2023·Granted Jan 21, 2025·0 cites·30 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Je-Hsiung Lan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →