Inventor · disambiguated record
Ebony L. Mays
Also filed as: MAYS EBONY · MAYS EBONY L · MAYS EBONY LYNN
12 granted patents·7 pending applications·160 citations·filing 2002–2025
89Inventor score
Top patents by PatentIndex Score
19 records- 0195US11380683B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Jul 5, 2022·3 cites·20 claims
- 0295US6815329B2Multilayer interconnect structure containing air gaps and method for makingIBM·Filed 2002·Granted Nov 9, 2004·105 cites·13 claims
- 0394US10734379B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Aug 4, 2020·9 cites·20 claims
- 0490US11990364B2Filling openings by combining non-flowable and flowable processesINTEL CORP·Filed 2022·Granted May 21, 2024·1 cites·18 claims
- 0589US10861850B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Dec 8, 2020·2 cites·20 claims
- 0688US7098476B2Multilayer interconnect structure containing air gaps and method for makingIBM·Filed 2004·Granted Aug 29, 2006·39 cites·4 claims
- 0785US12284826B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Granted Apr 22, 2025·0 cites·20 claims
- 0881US12300533B2Filling openings by combining non-flowable and flowable processesINTEL CORP·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 0979US2025194235A1Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2025·Application pending·0 cites
- 1079US2025239482A1Filling openings by combining non-flowable and flowable processesINTEL CORP·Filed 2025·Application pending·0 cites
- 1177US11961838B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 1270US11978657B2Filling openings by combining non-flowable and flowable processesINTEL CORP·Filed 2017·Granted May 7, 2024·1 cites·19 claims
- 1362US2023402389A1Integrated word line contact structures in three-dimensional (3d) memory arrayINTEL CORP·Filed 2023·Application pending·0 cites
- 1453US2022375870A1Gap-fill for 3d nand staircaseIntel NDTM US LLC·Filed 2022·Application pending·0 cites
- 1549US2023033086A1Varying channel width in three-dimensional memory arrayINTEL CORP·Filed 2020·Application pending·0 cites
- 1647US2021143100A1Integrated word line contact structures in three-dimensional (3d) memory arrayINTEL CORP·Filed 2019·Application pending·0 cites
- 1746US10811251B2Dielectric gap-fill material depositionINTEL CORP·Filed 2016·Granted Oct 20, 2020·0 cites·30 claims
- 1840US10964800B2Semiconductor device having fin-end stress-inducing featuresINTEL CORP·Filed 2016·Granted Mar 30, 2021·0 cites·12 claims
- 1935US2019035673A1Flowable dielectrics from vapor phase precursorsINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →