Inventor · disambiguated record
Erica J. Thompson
Also filed as: THOMPSON ERICA · THOMPSON ERICA J
13 granted patents·1 pending application·18 citations·filing 2013–2025
87Inventor score
Files withINTEL CORP14
Top patents by PatentIndex Score
14 records- 0195US11380683B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Jul 5, 2022·3 cites·20 claims
- 0294US10734379B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Aug 4, 2020·9 cites·20 claims
- 0389US10861850B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Dec 8, 2020·2 cites·20 claims
- 0485US12284826B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Granted Apr 22, 2025·0 cites·20 claims
- 0580US12453115B2Nanowire transistor structure and method of shapingINTEL CORP·Filed 2023·Granted Oct 21, 2025·0 cites·17 claims
- 0679US2025194235A1Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2025·Application pending·0 cites
- 0778US11869891B2Non-planar integrated circuit structures having mitigated source or drain etch from replacement gate processINTEL CORP·Filed 2018·Granted Jan 9, 2024·2 cites·6 claims
- 0877US11961838B2Fin end plug structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 0976US12302632B2Non-planar integrated circuit structures having mitigated source or drain etch from replacement gate processINTEL CORP·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1066US9472456B2Technology for selectively etching titanium and titanium nitride in the presence of other materialsINTEL CORP·Filed 2013·Granted Oct 18, 2016·2 cites·24 claims
- 1157US11869973B2Nanowire transistor structure and method of shapingINTEL CORP·Filed 2018·Granted Jan 9, 2024·0 cites·15 claims
- 1250US11563119B2Etchstop regions in fins of semiconductor devicesINTEL CORP·Filed 2017·Granted Jan 24, 2023·0 cites·14 claims
- 1340US10964800B2Semiconductor device having fin-end stress-inducing featuresINTEL CORP·Filed 2016·Granted Mar 30, 2021·0 cites·12 claims
- 1439US11443983B2Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchantINTEL CORP·Filed 2018·Granted Sep 13, 2022·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →