Inventor · disambiguated record
Jon Aday
Also filed as: ADAY JON G · ADAY JON GREGORY · Aday Jon
9 granted patents·3 pending applications·286 citations·filing 1998–2025
88Inventor score
Top patents by PatentIndex Score
12 records- 0196US9679855B1Polymer crack stop seal ring structure in wafer level packageQUALCOMM INC·Filed 2016·Granted Jun 13, 2017·20 cites·21 claims
- 0294US8017436B1Thin substrate fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2007·Granted Sep 13, 2011·33 cites·23 claims
- 0391US11003884B2Fingerprint sensor device and methods thereofQUALCOMM INC·Filed 2017·Granted May 11, 2021·5 cites·39 claims
- 0491US5969461ASurface acoustic wave device package and methodCTS CORP·Filed 1998·Granted Oct 19, 1999·190 cites·23 claims
- 0575US2025296083A1Hybrid glass plastic flow cell and fabrication methodsILLUMINA INC·Filed 2025·Application pending·0 cites
- 0674US12296333B2Hybrid glass plastic flow cell and fabrication methodsILLUMINA INC·Filed 2022·Granted May 13, 2025·0 cites·11 claims
- 0774US6494361B1Semiconductor module package substrate fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Dec 17, 2002·21 cites·24 claims
- 0871US6445075B1Semiconductor module package substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 3, 2002·17 cites·22 claims
- 0956US2024009665A1Fanout flow cellILLUMINA INC·Filed 2022·Application pending·0 cites
- 1056US2020066964A1Interface substrate and method of making the sameQUALCOMM INC·Filed 2019·Application pending·0 cites
- 1153US10516092B2Interface substrate and method of making the sameQUALCOMM INC·Filed 2016·Granted Dec 24, 2019·0 cites·10 claims
- 1252US12009352B2Fabricating wafers with electrical contacts on a surface parallel to an active surfaceILLUMINA INC·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →